Cross-Linking Behavior and Effect on Dielectric Characteristics of Benzocyclobutene-Based Polycarbosiloxanes,Macromolecules

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Cross-Linking Behavior and Effect on Dielectric Characteristics of Benzocyclobutene-Based Polycarbosiloxanes
Macromolecules ( IF 5.1 ) Pub Date : 2023-08-11 , DOI: 10.1021/acs.macromol.3c00784
Wenjie Fan _{1,

2} , Youpei Du ₃ , Ziwei Yuan ₄ , Pingxia Zhang ₁ , Wenxin Fu _{1,

2}

Affiliation

The cross-linked low-dielectric-constant material has garnered much attention in the rapid development of advanced electronics packaging. However, few studies have systematically explored the effects of cross-linking density and cross-linking degree on dielectric properties of benzocyclobutene (BCB)-based polymeric materials. Herein, a series of BCB-based polycarbosiloxanes with varying cross-linking densities were synthesized through Piers–Rubinsztajn polycondensation and post-Heck modification. The relationship between cross-linking behavior and the dielectric characteristics of cured materials was systematically explored using both molecular dynamics (MD) simulation and experimental verification. The results revealed that higher cross-linking density and cross-linking degree resulted in more microbranched structures, which effectively reduced the dielectric constant and dielectric loss of the materials. Moreover, high cross-linking density enhanced the thermal and dimensional stability and enabled a facile tuning of the mechanical property of the materials. Overall, our work offered a facile route to realize cross-linking process of BCB-based polymeric materials by MD simulation and to investigate the relationship between cross-linking and comprehensive performances, providing a valuable theoretical and experimental basis for the study of cross-linked low-dielectric-constant material.

中文翻译：

苯并环丁烯基聚碳硅氧烷的交联行为及其对介电特性的影响

交联低介电常数材料在先进电子封装的快速发展中引起了广泛关注。然而，很少有研究系统地探讨交联密度和交联度对苯并环丁烯（BCB）基聚合物材料介电性能的影响。在此，通过 Piers-Rubinsztajn 缩聚和 Heck 后改性合成了一系列具有不同交联密度的 BCB 基聚碳硅氧烷。通过分子动力学（MD）模拟和实验验证，系统地探讨了固化材料的交联行为和介电特性之间的关系。结果表明，较高的交联密度和交联度会产生更多的微支化结构，有效降低了材料的介电常数和介电损耗。此外，高交联密度增强了热稳定性和尺寸稳定性，并能够轻松调节材料的机械性能。总体而言，我们的工作为通过MD模拟实现BCB基聚合物材料的交联过程提供了简便的途径，并研究了交联与综合性能之间的关系，为交联的研究提供了有价值的理论和实验基础。低介电常数材料。

更新日期：2023-08-11

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