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High-Adhesion Ag Film with Enhanced Electromagnetic Shielding Performance via Post-Treatment of a Polydopamine Adhesive Layer
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2023-07-12 , DOI: 10.1021/acsami.3c06556 Jingyuan Zhang 1, 2 , Xiaodong Li 1, 2 , Mu Zhang 1, 2 , Qi Zhu 1, 2 , Xudong Sun 1, 2
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2023-07-12 , DOI: 10.1021/acsami.3c06556 Jingyuan Zhang 1, 2 , Xiaodong Li 1, 2 , Mu Zhang 1, 2 , Qi Zhu 1, 2 , Xudong Sun 1, 2
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Low adhesion limits the application of the conformal metal coating based on metal–organic complexing deposition (MOD) ink in electromagnetic interference shielding with an ultrathin thickness and excellent electromagnetic shielding performance. Here, the mussel-inspired polydopamine (PDA) coating with double-sided adhesive characteristic was used to modify the substrate surface, and a high-adhesion silver film was prepared by spin-coating MOD ink on the PDA-modified substrate. The surface chemical bond of the deposited PDA coating was found to change with the exposure time under air in this work, and three post-treatment methods were carried out on the PDA coatings, including exposure to air for 1 min, exposure to air for a day, and oven heat treatment. The influences of such three post-treatment methods of PDA coating on the structure of the substrate surface, the silver film adhesion property, the electrical property, and the electromagnetic shielding property were studied. The adhesion of the silver film was effectively enhanced up to 20.45 MPa by controlling the post-treatment method of the PDA coating. The PDA coating was found to increase the sheet resistance of the silver film and to absorb electromagnetic waves. By optimizing the deposition time and the post-treatment condition of the PDA coating, superior electromagnetic shielding effectiveness up to 51.18 dB was obtained with a thin silver film of 0.42 μm. The introduction of the PDA coating improves the applicability of the MOD silver ink in the field of conformal electromagnetic shielding.
中文翻译：
通过聚多巴胺粘合层后处理增强电磁屏蔽性能的高粘合银膜
低附着力限制了基于金属有机络合沉积（MOD）墨水的敷形金属涂层在超薄厚度和优异电磁屏蔽性能的电磁干扰屏蔽中的应用。在此，利用具有双面粘合特性的仿贻贝聚多巴胺（PDA）涂层对基材表面进行改性，并通过在PDA改性基材上旋涂MOD墨水来制备高附着力的银膜。本工作发现沉积的PDA涂层的表面化学键随着空气中暴露时间的变化而变化，并对PDA涂层进行了三种后处理方法，包括暴露在空气中1分钟、暴露在空气中1分钟。日，并进行烘箱热处理。研究了三种PDA镀膜后处理方法对基材表面结构、银膜附着性能、电性能和电磁屏蔽性能的影响。通过控制PDA涂层的后处理方法，银膜的附着力有效提高至20.45 MPa。研究发现 PDA 涂层可以增加银膜的方块电阻并吸收电磁波。通过优化PDA涂层的沉积时间和后处理条件，0.42μm的银薄膜获得了高达51.18dB的优异电磁屏蔽效能。PDA涂层的引入提高了MOD银墨水在共形电磁屏蔽领域的适用性。
更新日期：2023-07-12
中文翻译：
通过聚多巴胺粘合层后处理增强电磁屏蔽性能的高粘合银膜
低附着力限制了基于金属有机络合沉积（MOD）墨水的敷形金属涂层在超薄厚度和优异电磁屏蔽性能的电磁干扰屏蔽中的应用。在此，利用具有双面粘合特性的仿贻贝聚多巴胺（PDA）涂层对基材表面进行改性，并通过在PDA改性基材上旋涂MOD墨水来制备高附着力的银膜。本工作发现沉积的PDA涂层的表面化学键随着空气中暴露时间的变化而变化，并对PDA涂层进行了三种后处理方法，包括暴露在空气中1分钟、暴露在空气中1分钟。日，并进行烘箱热处理。研究了三种PDA镀膜后处理方法对基材表面结构、银膜附着性能、电性能和电磁屏蔽性能的影响。通过控制PDA涂层的后处理方法，银膜的附着力有效提高至20.45 MPa。研究发现 PDA 涂层可以增加银膜的方块电阻并吸收电磁波。通过优化PDA涂层的沉积时间和后处理条件，0.42μm的银薄膜获得了高达51.18dB的优异电磁屏蔽效能。PDA涂层的引入提高了MOD银墨水在共形电磁屏蔽领域的适用性。
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