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Preparation of High-k Polymeric Composites Based on Low-k Boron Nitride Nanosheets with High-Connectivity Lamellar Structure
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2023-07-01 , DOI: 10.1021/acsami.3c06143
Ruolin Han 1 , Jiafei Ren 1 , Zheng Zhou 1 , Guang-Xin Chen 1 , Qifang Li 2
Affiliation  

Typically, the basic method to enhance the dielectric response of polymer-based composites is to fill giant dielectric ceramic fillers, such as BaTiO3 and CaCu3Ti4O12, into the polymer matrix. Here, by using low-k boron nitride (BN) with well-controlled microstructure and surface, we successfully prepared a high-k polymeric composite, where the improvement in the dielectric constant of the composite even exceeds that of composites containing BaTiO3 and CaCu3Ti4O12 particles at the same weight percent. First, a lamellar boron nitride nanosheet (BNNS) aerogel was prepared by bidirectional freezing and freeze drying, respectively, and then the aerogel was calcined at 1000 °C to obtain the lamellar BNNS skeleton with some hydroxyl groups. Finally, the epoxy resin (EP) was vacuum impregnated into the BNNS skeleton and cured inside to prepare the lamellar-structured BNNSs/EP (LBE) composites. Interestingly, the dielectric constants of LBE with a 10 wt % BNNS content reached 8.5 at 103 Hz, which was higher by 2.7 times than that of pure EP. The experimental data and the finite element simulations suggested that the increased dielectric constants of LBE resulted from the combination of two factors, namely, the lamellar microstructure and the hydroxyl groups. The stacking of the BNNS phase into a highly connected lamellar skeleton significantly increased the internal electric field and the polarization intensity, while the introduction of hydroxyl groups on the BNNS surface further improved the polarization of the composite, resulting in a significant increase in the dielectric constant of the LBE. This work provides a new strategy for improving the dielectric constant through the microstructure design of composites.

中文翻译:

具有高连通性层状结构的低k氮化硼纳米片的高k聚合物复合材料的制备

通常,增强聚合物基复合材料介电响应的基本方法是将BaTiO 3和CaCu 3 Ti 4 O 12等巨型介电陶瓷填料填充到聚合物基体中。在这里,通过使用具有良好控制的微观结构和表面的低k氮化硼(BN),我们成功地制备了高k聚合物复合材料,该复合材料的介电常数的改善甚至超过了含有BaTiO 3 和CaCu的复合材料相同重量百分比的3 Ti 4 O 12颗粒。首先,分别通过双向冷冻和冷冻干燥制备了层状氮化硼纳米片(BNNS)气凝胶,然后将气凝胶在1000℃下煅烧以获得带有部分羟基的层状BNNS骨架。最后,将环氧树脂(EP)真空浸渍到BNNS骨架中并在内部固化,制备出层状结构的BNNSs/EP(LBE)复合材料。有趣的是,BNNS含量为10 wt%的LBE在10 3 Hz时的介电常数达到8.5 ,比纯EP高2.7倍。实验数据和有限元模拟表明,LBE介电常数的增加是层状微结构和羟基两个因素共同作用的结果。BNNS相堆叠成高度连接的层状骨架显着增加了内部电场和极化强度,而BNNS表面羟基的引入进一步改善了复合材料的极化,导致介电常数显着增加LBE 的。这项工作为通过复合材料的微观结构设计提高介电常数提供了新的策略。
更新日期:2023-07-01
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