通过一步静电纺丝制备用于可穿戴设备的导热、透气、疏水磺化聚（苯乙烯-乙烯/丁烯-苯乙烯）/氮化硼纳米片纳米纤维膜,ACS Applied Polymer Materials

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通过一步静电纺丝制备用于可穿戴设备的导热、透气、疏水磺化聚（苯乙烯-乙烯/丁烯-苯乙烯）/氮化硼纳米片纳米纤维膜
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2023-06-13 , DOI: 10.1021/acsapm.3c00352
Qiujuan Zeng ₁ , Lun Zhang ₁ , Jihai Zhang ₁ , Aimin Zhang ₁

Affiliation

基于高导热填料的聚合物材料已成为实现个人冷却、可穿戴设备热管理等可穿戴热管理的有效途径。高导热填料，例如氮化硼纳米片（BNNS），与纤维材料集成是构建高导热聚合物材料的一种有前途的方法。然而，许多制造工艺复杂且耗时。此外，大量的BNNS被加载到所得材料中以增强导热性。在这里，我们首先制备了疏水性磺化聚（苯乙烯-乙烯/丁烯-苯乙烯）（S-SEBS）/BNNS 纳米纤维膜，该膜具有高导热性和透气性，可通过简便的一步静电纺丝进行有效的热管理。这种策略使得 BNNS 沿着纳米纤维均匀分散。同时，保留了多孔结构，在不牺牲透气性的情况下增强导热性。因此，所得的透气纺织品表现出出色的热管理性能，具有16.37 W·m的超高面内导热系数^{在 BNNS 负载量为 15 wt% 时，具有–1} ·K ^{–1和 0.1037 W·m}^–1 ·K ^–1的面外热导率，以及可以抵抗污渍粘附的疏水表面，表明在可穿戴热管理应用中具有良好的实用性。

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Thermo-Conductive, Air-Permeable, and Hydrophobic Sulfonated Poly(Styrene-Ethylene/Butylene-Styrene)/Boron Nitride Nanosheet Nanofiber Membranes for Wearables via One-Step Electrospinning

Polymer materials based on highly thermal conductive fillers have emerged as an effective way to achieve wearable thermal management such as personal cooling, thermal management of wearable devices, and so on. Highly thermal conductive fillers, such as boron nitride nanosheets (BNNSs), integrated with fibrous materials are a promising way to construct highly thermal conductive polymer materials. However, many fabrication processes are complex and time consuming. Also, a large amount of BNNSs was loaded into the resultant materials to enhance thermal conductivity. Here, we first prepared hydrophobics sulfonated poly(styrene-ethylene/butylene-styrene) (S-SEBS)/BNNS nanofiber membranes with high thermal conductivity and air permeability for efficient thermal management via facile one-step electrospinning. This strategy made BNNSs uniformly disperse along the nanofibers. Meanwhile, the porous structure remained, enhancing thermal conductivity without sacrificing air permeability. Therefore, the resultant air-permeable textiles demonstrated outstanding thermal management performance with ultrahigh in-plane thermal conductivity of 16.37 W·m^–1·K^–1 and out-plane thermal conductivity of 0.1037 W·m^–1·K^–1 at BNNS loading of 15 wt % as well as a hydrophobic surface which could resist stain adhesion, indicating promising utility for wearable thermal management applications.

更新日期：2023-06-13

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