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Synthesis of Micron-Sized WS2 Crystallites Using Atomic Layer Deposition and Sulfur Annealing
Chemistry of Materials ( IF 7.2 ) Pub Date : 2023-06-09 , DOI: 10.1021/acs.chemmater.3c00013
Kamesh Mullapudi 1 , Rafik Addou 2 , Charles. L. Dezelah 3 , Daniel F. Moser 3 , Ravindra K. Kanjolia 3 , Jacob H. Woodruff 3 , John. F. Conley 1
Affiliation  

The synthesis of micron-sized WS2 crystallites via atomic layer deposition (ALD) is reported for the first time using bis(t-butylimido)bis(trimethylsilylmethyl)tungsten and H2S as reactants, followed by post-deposition annealing. Self-limiting growth on silicon is demonstrated between 315 and 350 °C. As-deposited films are nanocrystalline, comprising a mix of WS2 and WO3 phases along with residual amounts of WOxNy and SiOx impurities. Post-deposition annealing in elemental sulfur at 600 °C induces the emergence of the 2LA(M), E2g1(Γ), and A1g(Γ) Raman vibration modes for WS2 and increases crystallite size up to a few microns, the largest reported to date for ALD WS2. The growth substrate was found to impact WS2 morphology. Films grown and annealed on silicon produced two distinct morphologies of WS2 crystallites with (i) in-plane multilayered flake pyramids predominantly seen at 650 °C and (ii) out-of-plane “flowers” growing at 700 and 800 °C. Films grown and annealed on ZnS showed only out-of-plane “crumpled” flowers with a high density of WS2 edge sites suitable for catalysis, while films grown and annealed on Al2O3 showed predominately few-layered in-plane WS2 flakes, suitable for electronic devices.

中文翻译:

利用原子层沉积和硫退火合成微米级 WS2 微晶

首次报道了使用双(丁基亚氨基)双(三甲基甲硅烷基甲基)钨和H 2 S作为反应物,然后进行沉积后退火,通过原子层沉积(ALD )合成微米级WS 2微晶。硅上的自限性生长在 315 至 350 °C 之间得到证实。沉积薄膜是纳米晶体,包含WS 2和WO 3相的混合物以及残余量的WO x N y和SiO x杂质。在 600 °C 的元素硫中进行沉积后退火会导致 2LA(M)、E 2g 1 (Γ) 和 A 1g的出现(Γ) WS 2的拉曼振动模式并将微晶尺寸增加至几微米,这是迄今为止报道的 ALD WS 2的最大微晶尺寸。发现生长基质影响 WS 2形态。在硅上生长和退火的薄膜产生了两种不同形态的 WS 2微晶,其中 (i) 主要在 650 °C 下出现的面内多层片状金字塔和 (ii) 在 700 和 800 °C 下生长的面外“花”。在 ZnS 上生长和退火的薄膜仅显示出面外“皱缩”花朵,具有适合催化的高密度 WS 2边缘位点,而在 Al 2 O 3上生长和退火的薄膜主要显示出很少层的面内 WS 2薄片,适用于电子设备。
更新日期:2023-06-09
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