当前位置：
X-MOL 学术
›
J. Appl. Polym. Sci.
›
论文详情
Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
Toughening of alicyclic epoxy resin by in situ polymerization of modifier vinyl monomers using alkylborane as a radical initiator
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2023-06-05 , DOI: 10.1002/app.54254 Yuri Kajihara 1, 2 , Toshiyuki Oyama 1
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2023-06-05 , DOI: 10.1002/app.54254 Yuri Kajihara 1, 2 , Toshiyuki Oyama 1
Affiliation
|
In this study, we attempted to improve the toughness of alicyclic epoxy cured resin using a vinyl polymer as a modifier which was generated with alkylborane as a radical initiator in parallel with the curing of the resin. Alkylborane has the ability to initiate radical polymerization around room temperature in the presence of oxygen, and the use of diethylmethoxyborane (DEMB) instead of a conventional peroxide radical initiator (DBPC) was found to allow copolymerization of styrene (St) and N-phenylmaleimide (NPMI) in an alicyclic epoxy resin in the early stage of the multistep curing. As a result, only when DEMB was used as an initiator, a cured product with a phase-separated structure at which ca. 50–100 nm St/NPMI copolymer phases were dispersed was obtained. The fracture toughness (KIC) of the modified cured resin with DEMB was 0.77 MN/m3/2, which was 30% higher than that of the modified resin with DBPC. Furthermore, the glass transition temperature of the modified cured resin with DEMB reached 247°C, which was 87 and 63°C higher than the unmodified rein and the modified resin with DBPC, respectively, since DEMB acted as a Lewis acid to promote cationic polymerization of the alicyclic epoxy resin.
中文翻译：
烷基硼烷作为自由基引发剂改性乙烯基单体原位聚合增韧脂环族环氧树脂
在这项研究中，我们尝试使用乙烯基聚合物作为改性剂来提高脂环族环氧树脂固化树脂的韧性，该乙烯基聚合物是在树脂固化的同时用烷基硼烷作为自由基引发剂产生的。烷基硼烷能够在氧气存在的情况下在室温附近引发自由基聚合，并且发现使用二乙基甲氧基硼烷（DEMB）代替传统的过氧化物自由基引发剂（DBPC）可以使苯乙烯（St）和N-苯基马来酰亚胺发生共聚。 NPMI）在脂环族环氧树脂中处于多步固化的早期阶段。结果，仅当使用DEMB作为引发剂时，具有约100℃的相分离结构的固化产物。获得了分散的 50-100 nm St/NPMI 共聚物相。断裂韧性（KDEMB改性固化树脂的IC )为0.77MN/m 3/2，比DBPC改性树脂高30%。此外，DEMB改性固化树脂的玻璃化转变温度达到247℃，比未改性树脂和DBPC改性树脂分别高87℃和63℃，因为DEMB作为路易斯酸促进阳离子聚合。脂环族环氧树脂。
更新日期：2023-06-05
中文翻译：
烷基硼烷作为自由基引发剂改性乙烯基单体原位聚合增韧脂环族环氧树脂
在这项研究中，我们尝试使用乙烯基聚合物作为改性剂来提高脂环族环氧树脂固化树脂的韧性，该乙烯基聚合物是在树脂固化的同时用烷基硼烷作为自由基引发剂产生的。烷基硼烷能够在氧气存在的情况下在室温附近引发自由基聚合，并且发现使用二乙基甲氧基硼烷（DEMB）代替传统的过氧化物自由基引发剂（DBPC）可以使苯乙烯（St）和N-苯基马来酰亚胺发生共聚。 NPMI）在脂环族环氧树脂中处于多步固化的早期阶段。结果，仅当使用DEMB作为引发剂时，具有约100℃的相分离结构的固化产物。获得了分散的 50-100 nm St/NPMI 共聚物相。断裂韧性（KDEMB改性固化树脂的IC )为0.77MN/m 3/2，比DBPC改性树脂高30%。此外，DEMB改性固化树脂的玻璃化转变温度达到247℃，比未改性树脂和DBPC改性树脂分别高87℃和63℃，因为DEMB作为路易斯酸促进阳离子聚合。脂环族环氧树脂。
京公网安备 11010802027423号