Fabrication of High Thermal Conductivity Nanodiamond/Aramid Nanofiber Composite Films with Superior Multifunctional Properties,ACS Applied Materials & Interfaces

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Fabrication of High Thermal Conductivity Nanodiamond/Aramid Nanofiber Composite Films with Superior Multifunctional Properties
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2023-05-22 , DOI: 10.1021/acsami.3c02574
Xiaolei Wang ₁ , Wenxin Cao ₁ , Zhenhua Su ₁ , Kunlong Zhao ₁ , Bing Dai ₁ , Ge Gao ₁ , Jiwen Zhao ₁ , Kechen Zhao ₁ , Zhuochao Wang ₁ , Tingting Sun ₁ , Jiecai Han ₁ , Jiaqi Zhu _{1,

2}

Affiliation

Polymer-based thermally conductive materials are preferred for heat dissipation owing to their low density, flexibility, low cost, and easy processing. Researchers have been trying to develop a polymer-based composite film with excellent thermal conductivity (TC), mechanical strength, thermal stability, and electrical properties. However, synergistically achieving these properties in a single material is still a challenge. To address the above requirements, we prepared poly(diallyldimethylammonium chloride)-functionalized nanodiamond (ND@PDDA)/aramid nanofiber (ANF) composite films using a self-assembly strategy. Owing to a strong interfacial interaction arising from electrostatic attraction, ND particles attract strongly along the ANF axis to form ANF/ND “core–sheath” arrangements. These assemblies self-construct three-dimensional thermally conductive networks through ANF gelation precipitation, which was analyzed as the key parameter for the realization of high thermal performances. The as-prepared ND@PDDA/ANF composite films exhibited high in-plane and through-plane TCs up to 30.99 and 6.34 W/m·K, respectively, at a 50 wt % functionalized ND loading, representing the optimal values among all previously reported polymer-based electrical insulating composite films. Furthermore, the nanocomposites also achieved other properties necessary for realistic applications, such as outstanding mechanical properties, excellent thermal stability, ultra-low thermal expansion coefficient, excellent electrical insulation, low dielectric constant, low dielectric loss, and outstanding flame retardancy. Thus, this excellent comprehensive performance enables the ND@PDDA/ANF composite films to be used as advanced multifunctional nanocomposites in thermal management, flexible electronics, and intelligent wearable equipment.

中文翻译：

具有优异多功能性能的高导热纳米金刚石/芳纶纳米纤维复合膜的制备

聚合物基导热材料由于其低密度、柔韧性、低成本和易于加工而成为散热的首选。研究人员一直在尝试开发一种具有优异导热性（TC）、机械强度、热稳定性和电性能的聚合物基复合薄膜。然而，在单一材料中协同实现这些特性仍然是一个挑战。为了满足上述要求，我们采用自组装策略制备了聚（二烯丙基二甲基氯化铵）功能化纳米金刚石（ND@PDDA）/芳纶纳米纤维（ANF）复合薄膜。由于静电吸引引起的强烈界面相互作用，ND 颗粒沿 ANF 轴强烈吸引，形成 ANF/ND“芯-鞘”排列。这些组件通过 ANF 凝胶沉淀自构建三维导热网络，分析认为这是实现高热性能的关键参数。所制备的 ND@PDDA/ANF 复合薄膜在 50 wt% 功能化 ND 负载量下表现出高的面内和面内 TC，分别高达 30.99 和 6.34 W/m·K，代表了所有先前的最佳值报道了基于聚合物的电绝缘复合膜。此外，纳米复合材料还实现了实际应用所需的其他性能，例如出色的机械性能、出色的热稳定性、超低的热膨胀系数、出色的电绝缘性、低介电常数、低介电损耗和出色的阻燃性。因此，

更新日期：2023-05-22

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