Phase change microcapsules, which feature high latent heat and stability and can well mix with epoxy resin substrates, were synthesized through the solvent-free interfacial polymerization method with palmityl palmitate as the core material and low-toxicity dicyclohexylmethane 4,4′-diisocyanate as the shell material. The synthesized microcapsules were characterized by multiple techniques. The performances of microcapsules at different core-shell ratios were compared, and the applicabilities of epoxy resins with different contents of optimal microcapsules were investigated. Results show that, at a core-shell ratio of 16:4, the synthesized microcapsules achieve an encapsulation rate of 84.47%, and their enthalpies of melting and crystallization reach 218.49 J/g and 219.72 J/g, respectively. Moreover, the microcapsules exhibit outstanding thermal stability and reliability. They can remain intact without leakage after heating at 150 °C for 2 h, and their enthalpies of melting and crystallization can remain over 196.58 J/g and 202.23 J/g after 500 heating and cooling cycles. In addition, the microcapsules can uniformly disperse in epoxy resin, significantly influencing its heat transfer property and temperature regulation ability. With a 15% microcapsule content, the epoxy resin has a reduced thermal conductivity of 0.5834 W/mK, with delays of 76.0% and 51.4% in the time used for the temperature rise/fall process.

【摘要】：以棕榈酸棕榈酯为芯材,低毒二环己基甲烷4,4'-二异氰酸酯为核心材料,采用无溶剂界面聚合法合成了具有高潜热性和稳定性、与环氧树脂基材良好混合的相变微胶囊。外壳材料。合成的微胶囊通过多种技术表征。比较了不同核壳比微胶囊的性能，考察了不同含量最佳微胶囊对环氧树脂的适用性。结果表明，在核壳比为16:4时，合成的微胶囊包封率达到84.47%，熔化焓和结晶焓分别达到218.49 J/g和219.72 J/g。而且，微胶囊表现出出色的热稳定性和可靠性。它们在150℃加热2小时后仍能保持完好无泄漏，经过500次加热和冷却循环后，它们的熔化和结晶焓仍能保持在196.58 J/g和202.23 J/g以上。此外，微胶囊能在环氧树脂中均匀分散，显着影响其传热性能和温度调节能力。微胶囊含量为 15% 时，环氧树脂的导热系数降低为 0.5834 W/mK，升温/降温过程的时间延迟分别为 76.0% 和 51.4%。此外，微胶囊能在环氧树脂中均匀分散，显着影响其传热性能和温度调节能力。微胶囊含量为 15% 时，环氧树脂的导热系数降低为 0.5834 W/mK，升温/降温过程的时间延迟分别为 76.0% 和 51.4%。此外，微胶囊能在环氧树脂中均匀分散，显着影响其传热性能和温度调节能力。微胶囊含量为 15% 时，环氧树脂的导热系数降低为 0.5834 W/mK，升温/降温过程的时间延迟分别为 76.0% 和 51.4%。