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Thermal and dielectric multiple percolation in α-Si3N4 whiskers/silicone rubber
Polymer Engineering and Science ( IF 3.2 ) Pub Date : 2023-03-22 , DOI: 10.1002/pen.26299
Dian Zhang 1 , Jiawen Liu 1 , Xiaofeng Yang 1, 2 , Xuan Liu 1 , Qingquan Liang 1 , Yijun Liu 3
Affiliation  

Currently, thermal interfacial materials (TIMs) play a great role to electronic and semiconductor devices working at high voltage, power and frequency. The urgent need for electrical insulating TIMs and relevant theory are not addressed yet. This study adopted an electrical insulating α-Si3N4 whisker as a filler to prepare Si3N4w/silicone rubber. The results show that the elongation at break and thermal conductivity of silicone rubber are promoted from 91.6% and 0.343 to 402.9% and 1.011 W m−1 K−1, respectively, at a filler fraction of 8.0 vol%. It reveals a multiple percolation phenomenon which has not been previously observed in an electrical insulating TIMs. The thermal percolation threshold is decreased to 4.0 vol% with increasing aspect ratio of the whisker. The behavior of the dielectric strength is explained by a double percolation model. A phonon quasi-ballistic transportation mechanism based on Coulomb interactions is proposed for the TIMs.

中文翻译:

α-Si3N4 晶须/硅橡胶中的热和介电多次渗滤

目前,热界面材料 (TIM) 在高压、高功率和高频率下工作的电子和半导体器件中发挥着重要作用。尚未解决对电绝缘 TIM 和相关理论的迫切需求。本研究采用电绝缘α-Si 3 N 4晶须作为填料制备Si 3 N 4w /硅橡胶。结果表明,硅橡胶的断裂伸长率和导热系数从91.6%和0.343提升到402.9%和1.011 W m -1  K -1,分别为 8.0 vol% 的填料分数。它揭示了以前在电绝缘 TIM 中未观察到的多重渗流现象。随着晶须纵横比的增加,热渗透阈值降低至 4.0 vol%。介电强度的行为由双渗流模型解释。针对 TIM 提出了一种基于库仑相互作用的声子准弹道输运机制。
更新日期:2023-03-22
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