Cu-based materials are seldom reported as oxygen evolution reaction (OER) electrocatalysts due to their inherent electron orbital configuration, which makes them difficult to adsorb oxygen-intermediates during OER. Reasonably engineering the hierarchical architectures and the electronic structures can improve the performance of Cu-based OER catalysts, such as constructing multilevel morphology, inducing the porous materials, improving the Cu valence, building heterostructures, doping heteroatoms, etc. In this work, copper-1,3,5-benzenetricarboxylate (HKUST-1) octahedra in-situ grow on the Cu nanorod (NR)-supported N-doped carbon microplates, meanwhile an active layer of Cu(OH)₂ forms on the surface of the original conductive Cu NRs. The octahedral HKUST-1, serving as a spacer between the microplates, greatly improves the porosity and increases the available active sites, facilitating the mass transport and electron transfer, thus resulting in greatly enhanced OER performance.

Cu 基材料由于其固有的电子轨道构型而很少被报道为析氧反应 (OER) 电催化剂，这使得它们在 OER 过程中难以吸附氧中间体。合理设计层次结构和电子结构可以提高铜基 OER 催化剂的性能，例如构建多能级形貌、诱导多孔材料、提高铜价、构建异质结构、掺杂杂原子等。在这项工作中，铜- 1,3,5-苯三甲酸酯 (HKUST-1) 八面体原位生长在 Cu 纳米棒 (NR) 负载的 N 掺杂碳微板上，同时形成 Cu(OH) _2活性层在原始导电 Cu NRs 的表面上形成。八面体 HKUST-1 作为微板之间的间隔物，大大提高了孔隙率并增加了可用的活性位点，促进了传质和电子转移，从而大大提高了 OER 性能。