Superhydrophobic surface can be used in electronic devices to provide additional protection due to its waterproofing, anti-icing, low adhesion, and self-cleaning properties. In this study, a facile and efficient method is used to fabricate flexible, conductive, and superhydrophobic films. The copper-silver film with nanoparticles with the diameters of 50–500 nm was decorated on the flexible TPU substrate by electroless copper plating and spraying AgNO₃ aqueous solution. After vacuum drying for 4 h, a superhydrophobic film was obtained without any surface modification. The formation mechanism of the micro-nano rough hierarchical structure and the reason for the formation of superhydrophobicity were studied, and the influence of the solution concentration and spraying times on the surface wettability during the spraying process was discussed. Through a series of tensile, bending, and impact tests, it was verified that the prepared flexible conductive superhydrophobic films had good mechanical stability. In addition, the film shows excellent low adhesion, self-cleaning, and conductivity in some experiments and is expected to be applied to flexible sensors, stretchable electronic devices, and wearable electronic devices.

Graphical Abstract