Cu is an ideal candidate for the sacrificial template to obtain hollow nanostructures because of its abundency and price compared with noble metals. However, the rapid oxidative etching rate of Cu is an obstacle when tailoring the morphology of hollow nanostructures. We use Cu nanocubes as a sacrificial template to obtain CuRu nanocages and nanoframes by controlling the oxidative etching rate of Cu nanocubes through the Ar flow rate. The oxidative etching of Cu nanocubes begins from the [110] direction and transforms from a cube (enclosed by six {200} facets) to a rhombicuboctahedron (enclosed by six {200}, eight {111}, and 12 {220} facets). The CuRu nanocages are obtained through the deposition of Ru atoms on all facets of the rhombicuboctahedron followed by diffusion or substitution into the surface to form alloyed CuRu layers from the slow oxidative-etched Cu nanocubes at an Ar flow rate of 20 mL/min. The CuRu nanoframes are obtained through the deposition of Ru atoms only on the {200} and {111} facets of the rhombicuboctahedron followed by diffusion or substitution into the surface to form alloyed CuRu layers from the fast oxidative-etched Cu nanocubes at an Ar flow rate of 10 mL/min.

中文翻译：

---

在 CuRu 纳米笼和纳米框架的合成中控制 Cu 纳米立方体的氧化蚀刻速率

与贵金属相比，Cu 是获得中空纳米结构的牺牲模板的理想候选者，因为它的丰富性和价格。然而，在定制中空纳米结构的形态时，Cu 的快速氧化蚀刻速率是一个障碍。我们使用 Cu 纳米立方体作为牺牲模板，通过 Ar 流速控制 Cu 纳米立方体的氧化蚀刻速率来获得 CuRu 纳米笼和纳米框架。Cu纳米立方体的氧化刻蚀从[110]方向开始，从立方体（由六个{200}面包围）转变为菱形八面体（由六个{200}、八个{111}和12个{220}面包围） . CuRu 纳米笼是通过在菱形立方八面体的所有面上沉积 Ru 原子，然后在 20 mL/min 的 Ar 流速下从缓慢氧化蚀刻的 Cu 纳米立方体扩散或置换到表面形成合金 CuRu 层而获得的。CuRu 纳米框架是通过仅在菱形立方八面体的 {200} 和 {111} 面上沉积 Ru 原子，然后扩散或置换到表面以在 Ar 流下从快速氧化蚀刻的 Cu 纳米立方体形成合金 CuRu 层获得的速率为 10 毫升/分钟。