Wood Science and Technology ( IF 3.1 ) Pub Date : 2022-12-03 , DOI: 10.1007/s00226-022-01434-6
Heiko Andrä , Dascha Dobrovolskij , Max Engelhardt , Michael Godehardt , Michael Makas , Christian Mercier , Stefan Rief , Katja Schladitz , Sarah Staub , Karol Trawka , Sebastian Treml
|
The thermal conductivity of wood fiber insulation boards is significantly influenced by the microstructure of the fiber network and in general, the efficiency of wood fiber insulation boards increases with porosity. For higher raw densities, the raw density is a good predictor for the thermal conductivity. For lower raw densities however, this simple relation does not hold anymore. Here, structural information gained from 3D computed tomography images at several scales, modeling of the microstructure, and numerical simulation of the thermal conductivity are combined to get deeper insight into which and how microstructural features influence the thermal conductivity. The model-based simulation as described here shows that the presence and orientation of wood fiber clusters impact the thermal conductivity significantly.
中文翻译:
![](https://scdn.x-mol.com/jcss/images/paperTranslation.png)
基于图像的高孔木纤维保温板热导率微观结构模拟
木纤维保温板的导热性受纤维网络微观结构的显着影响,一般而言,木纤维保温板的效率随着孔隙率的增加而增加。对于更高的原始密度,原始密度是热导率的良好预测指标。然而,对于较低的原始密度,这种简单的关系不再成立。在这里,从多个尺度的 3D 计算机断层扫描图像获得的结构信息、微观结构建模和导热系数的数值模拟相结合,以更深入地了解微观结构特征影响导热系数的方式和方式。此处描述的基于模型的模拟表明,木纤维簇的存在和方向对热导率有显着影响。