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Low-dielectric and low-temperature curable fluorinated nano carbon/polyimide composites with 6-aminoquinoline for end capping
Polymer Composites ( IF 4.8 ) Pub Date : 2022-11-24 , DOI: 10.1002/pc.27140 Jialin Zhang 1, 2 , Yuying Sui 1 , Jinhui Li 1 , Liang Shan 1 , Fangfang Niu 3 , Guoping Zhang 1 , Rong Sun 1
Polymer Composites ( IF 4.8 ) Pub Date : 2022-11-24 , DOI: 10.1002/pc.27140 Jialin Zhang 1, 2 , Yuying Sui 1 , Jinhui Li 1 , Liang Shan 1 , Fangfang Niu 3 , Guoping Zhang 1 , Rong Sun 1
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One challenge in the high-performance dielectric material of polyimide (PI) is to obtain the excellent comprehensive properties at low curing temperature for advanced IC package. In this work, 6-aminoquinoline (AQL) is introduced through covalent bonds for end capping to obtain a low-temperature curable PI at first. The results demonstrate that with very limited introduce (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200°C. Then, fluorinated nano carbon (FC) is further introduced resulting in the fluorinated nano carbon/polyimide (FCPI) composites, which effectively reduces the dielectric constant (1 wt%, 2.75 @ 1 MHz). Besides, the as-prepared FCPIs also possess excellent thermal property of which FCPI-0.3 exhibited the 5% weight loss temperature of 540°C and the glass transition temperature is also as high as 385°C. Furthermore, the tensile strength of the film is 127 MPa, the elongation at break is around 15.82%, and the Youngs' modulus is about 3.10 GPa proving the superior mechanical property. As a result, the successful preparation of the FCPI nanocomposites not only possess low-temperature curing and low-dielectric performance but also exhibit excellent thermal and mechanical properties, which shows a wide range of application prospects in the field of microelectronics for the advanced electronic package.
中文翻译：
具有用于封端的 6-氨基喹啉的低介电低温可固化氟化纳米碳/聚酰亚胺复合材料
聚酰亚胺（PI）高性能介电材料的一大挑战是在低固化温度下获得优异的综合性能，用于先进的IC封装。在这项工作中，首先通过共价键引入6-氨基喹啉（AQL）进行封端以获得低温可固化的PI。结果表明，在引入非常有限的 AQL (2.76%) 的情况下，亚胺化指数在 200°C 时可高达 1.01。然后，进一步引入氟化纳米碳 (FC)，形成氟化纳米碳/聚酰亚胺 (FCPI) 复合材料，从而有效降低介电常数（1 wt%，2.75 @ 1 MHz）。此外，所制备的FCPIs还具有优异的热性能，其中FCPI-0.3的5%失重温度为540℃，玻璃化转变温度也高达385℃。此外，薄膜的拉伸强度为 127 MPa，断裂伸长率约为 15.82%，杨氏模量约为 3.10 GPa，证明了优异的机械性能。因此，成功制备的FCPI纳米复合材料不仅具有低温固化和低介电性能，还表现出优异的热性能和机械性能，在先进电子封装的微电子领域显示出广泛的应用前景。 .
更新日期：2022-11-24
中文翻译：
具有用于封端的 6-氨基喹啉的低介电低温可固化氟化纳米碳/聚酰亚胺复合材料
聚酰亚胺（PI）高性能介电材料的一大挑战是在低固化温度下获得优异的综合性能，用于先进的IC封装。在这项工作中，首先通过共价键引入6-氨基喹啉（AQL）进行封端以获得低温可固化的PI。结果表明，在引入非常有限的 AQL (2.76%) 的情况下，亚胺化指数在 200°C 时可高达 1.01。然后，进一步引入氟化纳米碳 (FC)，形成氟化纳米碳/聚酰亚胺 (FCPI) 复合材料，从而有效降低介电常数（1 wt%，2.75 @ 1 MHz）。此外，所制备的FCPIs还具有优异的热性能，其中FCPI-0.3的5%失重温度为540℃，玻璃化转变温度也高达385℃。此外，薄膜的拉伸强度为 127 MPa，断裂伸长率约为 15.82%，杨氏模量约为 3.10 GPa，证明了优异的机械性能。因此，成功制备的FCPI纳米复合材料不仅具有低温固化和低介电性能，还表现出优异的热性能和机械性能，在先进电子封装的微电子领域显示出广泛的应用前景。 .
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