Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition,Advanced Energy Materials

当前位置： X-MOL 学术 › Adv. Energy Mater. › 论文详情

Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)

Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition
Advanced Energy Materials ( IF 24.4 ) Pub Date : 2022-11-09 , DOI: 10.1002/aenm.202202843
Gabriel R. McAndrews ₁ , Andrew L. Yeang ₂ , Yuchun Cai ₃ , Christopher J. Barile ₄ , Michael D. McGehee _{1,

2}

Affiliation

Dynamic windows based on reversible metal electrodeposition (RME) can electronically adjust light transmission from ≈70% to <0.1% to improve building aesthetics and energy efficiency by controlling light and heat flow. For RME devices using Cu and Bi, the windows reach “privacy state” (<0.1% transmission) when ≈180 nm of metal is electrodeposited on the transparent conducting electrode. When films with a plated atomic Cu–Bi ratio of ≈2:1 rest in the privacy state, sinusoidal cracks form across the entire film, and the metal delaminates in <1 day. This mechanical failure renders the window unusable as specks of metal are visually unattractive and reduce the dynamic range of the window. The Cu–Bi film is stress free upon deposition, but after 4 h of resting, 38 MPa of tensile stress develops. The tension in Cu–Bi and Cu films combined with the Cu(ClO₄)₂ in the electrolyte results in severe, widespread fractures and delamination due to stress corrosion cracking. In contrast, electrodeposited Bi films have compressive stress, likely due to high self-diffusion and insertion of atoms into grain boundaries while plating, which results in a Bi-based dynamic window with crack-free resting stability that exceeds 9 weeks.

中文翻译：

基于可逆金属电沉积的动态窗口了解和提高电沉积铜和铋的机械稳定性

基于可逆金属电沉积 (RME) 的动态窗户可以通过电子方式将透光率从 ≈70% 调整到 <0.1%，通过控制光和热流来改善建筑美观和能源效率。对于使用 Cu 和 Bi 的 RME 设备，当 ≈180 nm 的金属电沉积在透明导电电极上时，窗口达到“隐私状态”（<0.1% 透射率）。当镀层 Cu-Bi 原子比约为 2:1 的薄膜处于隐私状态时，整个薄膜会形成正弦裂缝，并且金属会在不到 1 天内分层。这种机械故障导致窗口无法使用，因为金属斑点在视觉上没有吸引力，并且会降低窗口的动态范围。Cu-Bi 薄膜在沉积时无应力，但在静置 4 小时后，会产生 38 MPa 的拉伸应力。₄ ) ₂在电解液中由于应力腐蚀开裂导致严重、广泛的断裂和分层。相比之下，电沉积 Bi 薄膜具有压应力，这可能是由于高自扩散和原子在电镀时插入晶界，这导致 Bi 基动态窗口具有超过 9 周的无裂纹静止稳定性。

更新日期：2022-11-09

点击分享查看原文

点击收藏

阅读更多本刊新发论文本刊介绍/投稿指南