Monodispersed polystyrene-nickel (PS-Ni) composite microspheres were used to enhance the conductivity of epoxy-based anisotropic conductive adhesive (ACA) for the first time. Specifically designed PS-Ni composite microspheres were used as conductive elements to construct anisotropic conductive arrays. The surface microstructure and morphology of the prepared PS-Ni composite microspheres were tuned by controlling the implementation method of electroless plating and concentration of Ni precursor. The structural composition, thermal properties, and electrical properties of PS-Ni composite microspheres were analyzed. In addition, diglycidyl ether of bisphenol-A (DGEBA) epoxy resin and low molecular weight polyamide resin were used as the matrix resin and curing agent, respectively. The optimal process parameters were employed and predicted based on the curing kinetics. A simple strategy was developed for the preparation of anisotropic conductive binders (viz. PS-Ni/EP-ACAs) via physical doping by addition of terminal carboxyl-terminated butadiene acrylonitrile (CTBN) copolymer and additives. PS-Ni/EP-ACAs exhibited satisfactory anisotropic electrical properties in fabricated components due to submicron structures composed of PS-Ni composite microspheres with excellent integrated properties in the anisotropic conducting array. Therefore, the theoretical concept and fabrication mean proposed in this study showed great potential and practical application in large-scale ACAs preparation.

首次采用单分散聚苯乙烯-镍（PS-Ni）复合微球增强环氧基各向异性导电胶（ACA）的导电性。专门设计的 PS-Ni 复合微球被用作导电元件来构建各向异性导电阵列。通过控制化学镀的实施方法和Ni前驱体的浓度来调整制备的PS-Ni复合微球的表面微观结构和形貌。分析了PS-Ni复合微球的结构组成、热性能和电性能。此外，双酚A二缩水甘油醚（DGEBA）环氧树脂和低分子量聚酰胺树脂分别用作基体树脂和固化剂。基于固化动力学采用和预测最佳工艺参数。通过添加末端羧基末端丁二烯丙烯腈 (CTBN) 共聚物和添加剂的物理掺杂，开发了一种简单的策略来制备各向异性导电粘合剂（即 PS-Ni/EP-ACA）。PS-Ni/EP-ACA 在制造的组件中表现出令人满意的各向异性电性能，这是由于由 PS-Ni 复合微球组成的亚微米结构在各向异性导电阵列中具有优异的集成性能。因此，本研究提出的理论概念和制备方法在大规模 ACA 制备中显示出巨大的潜力和实际应用。PS-Ni/EP-ACA) 通过添加末端羧基末端丁二烯丙烯腈 (CTBN) 共聚物和添加剂进行物理掺杂。PS-Ni/EP-ACA 在制造的组件中表现出令人满意的各向异性电性能，这是由于由 PS-Ni 复合微球组成的亚微米结构在各向异性导电阵列中具有优异的集成性能。因此，本研究提出的理论概念和制备方法在大规模 ACA 制备中显示出巨大的潜力和实际应用。PS-Ni/EP-ACA) 通过添加末端羧基末端丁二烯丙烯腈 (CTBN) 共聚物和添加剂进行物理掺杂。PS-Ni/EP-ACA 在制造的组件中表现出令人满意的各向异性电性能，这是由于由 PS-Ni 复合微球组成的亚微米结构在各向异性导电阵列中具有优异的集成性能。因此，本研究提出的理论概念和制备方法在大规模 ACA 制备中显示出巨大的潜力和实际应用。PS-Ni/EP-ACA 在制造的组件中表现出令人满意的各向异性电性能，这是由于由 PS-Ni 复合微球组成的亚微米结构在各向异性导电阵列中具有优异的集成性能。因此，本研究提出的理论概念和制备方法在大规模 ACA 制备中显示出巨大的潜力和实际应用。PS-Ni/EP-ACA 在制造的组件中表现出令人满意的各向异性电性能，这是由于由 PS-Ni 复合微球组成的亚微米结构在各向异性导电阵列中具有优异的集成性能。因此，本研究提出的理论概念和制备方法在大规模 ACA 制备中显示出巨大的潜力和实际应用。