注塑包覆编织碳纤维/PEEK-短碳纤维/PEEK复合材料部件的结合强度和结合机理,Journal of Applied Polymer Science

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注塑包覆编织碳纤维/PEEK-短碳纤维/PEEK复合材料部件的结合强度和结合机理
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2022-10-17 , DOI: 10.1002/app.53222
Tianzhengxiong Deng ₁ , Zhigao Huang ₁ , Bing Zheng ₁ , Wei Jiang ₁ , Lu Chen ₁ , Cheng Chen ₁ , Helezi Zhou ₁ , Huamin Zhou ₁

Affiliation

在注塑包覆成型过程中，注塑塑料和基板之间会形成弱界面。本研究调查了模具温度和熔体温度对注塑包覆成型部件粘合强度的影响，这些部件是通过将短碳纤维增强聚醚醚酮 (SCF/PEEK) 注射到编织碳纤维增强 PEEK 表面上而制成的(WCF/PEEK) 层压基板。结果表明，随着模具温度从 190°C 升高到 260°C，界面层流剪切强度 (ILSS) 从 15.8 MPa 显着增加到 50.0 MPa。ILSS随着熔体温度从380°C升高到420°C先升高后降低，在410°C熔体温度时达到最大值44.4 MPa。结晶度分析和显微观察表明在界面处形成了不同的键合模式。基质富集区出现基质缠结，凹坑处出现交错缠结，纤维表面出现弱缠结和裂纹。模具温度通过改变结晶特性和界面连接方式影响ILSS，而熔体温度通过改变基体缠结面积影响ILSS。讨论了工艺条件—界面微观结构—界面力学性能之间的关系。模具温度通过改变结晶特性和界面连接方式影响ILSS，而熔体温度通过改变基体缠结面积影响ILSS。讨论了工艺条件—界面微观结构—界面力学性能之间的关系。模具温度通过改变结晶特性和界面连接方式影响ILSS，而熔体温度通过改变基体缠结面积影响ILSS。讨论了工艺条件—界面微观结构—界面力学性能之间的关系。

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Bond strength and bond mechanism of injection over-molded woven carbon fiber/PEEK-short carbon fiber/PEEK composite components

A weak interface is formed between injected plastic and substrate during the injection over-molding process. This study investigated the effects of mold temperature and melt temperature on the bond strength of injection over-molded components, which were produced by injecting short carbon fiber reinforced polyether-ether-ketone (SCF/PEEK) onto the surface of woven carbon fiber reinforced PEEK (WCF/PEEK) laminate substrate. The results show that the interfacial laminar shear strength (ILSS) increases significantly from 15.8 to 50.0 MPa as the mold temperature raises from 190 to 260°C. The ILSS increases first and then decreases with melt temperature raises from 380 to 420°C, achieving a maximum value of 44.4 MPa at 410°C melt temperature. Crystallinity analysis and microscopic observations indicate different bonding modes are formed at the interface. The matrix tangling appears in the matrix enrichment area, interlocking, and tangling appear in the pits and weak tangling and cracks occur on the fiber surface. The mold temperature affects the ILSS by changing the crystallization property and the connection mode in the interface, while the melt temperature affects the ILSS by changing the area of the matrix entanglement. The relationship between the process conditions—interfacial microstructure—interfacial mechanical performance was discussed.

更新日期：2022-10-17

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