用于高级封装中临时键合和脱键的热塑性聚酰亚胺的可控热酰亚胺化,ACS Applied Polymer Materials

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用于高级封装中临时键合和脱键的热塑性聚酰亚胺的可控热酰亚胺化
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2022-10-17 , DOI: 10.1021/acsapm.2c01415
Da Huang _{1,

2} , Jinshan Liu _{1,

2} , Jinhui Li ₁ , Fangcheng Wang ₁ , Kang Li ₁ , Qiang Liu ₁ , Huimin Yin _{1,

2} , Guoping Zhang ₁ , Rong Sun ₁

Affiliation

临时键合和脱键 (TBDB) 是半导体领域实现器件 2.5D/3D 集成的关键技术。然而，作为 TBDB 中激光响应材料的传统聚酰亚胺，由于高温亚胺化，在非质子极性溶剂中表现出极差的溶解性，从而限制了脱粘后晶圆的清洁工艺。本文开发了一种控制固化温度以提高热塑性聚酰亚胺（TPI）溶解度的可行方法。结果证明，TPI在200°C固化（TPI-200°C）的最终溶解度可高达28.4 wt%。此外，TPI-200 °C 在 355 nm 紫外波长下表现出优异的耐热性、出色的机械性能和超高吸收率 (99.96%)。同时，我们证明了所制备的 TPI 材料在 TBDB 工艺中应用的可行性，显示出优异的效率和低成本，并且对清洁后的晶圆表面进行后续元素分析证明 TPI-200 °C 可以在剥离后完全去除. 所有这些结果表明，可用于 TBDB 的 TPI 材料在先进电子封装领域具有超薄芯片封装和晶圆级封装（WLP）的前景。

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Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Temporary bonding and debonding (TBDB) is a key technology in the semiconductor field to enable 2.5D/3D integration of devices. However, the conventional polyimides, which serve as the laser-response material in TBDB, exhibit extremely poor solubility in aprotic polar solvents due to high-temperature imidization, limiting the cleaning process for wafers after debonding. Herein, a feasible method of controlling the curing temperature to enhance the solubility of thermoplastic polyimide (TPI) has been developed. The results proved that the ultimate solubility of TPI cured at 200 °C (TPI-200 °C) could be as high as 28.4 wt %. Besides, TPI-200 °C exhibits excellent heat resistance, outstanding mechanical properties, and ultrahigh absorptivity (99.96%) at a 355 nm UV wavelength. Meanwhile, we demonstrate the feasibility of the as-prepared TPI material for application in the TBDB process, showing excellent efficiency and low cost, and the follow-up elemental analysis of the cleaned wafer surfaces proved that TPI-200 °C can be completely removed after debonding. All these results demonstrate that TPI materials that can be used for TBDB are promising for ultrathin chip packaging and wafer level packaging (WLP) in the field of advanced electronic packaging.

更新日期：2022-10-17

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