To investigate the influence of CuPc-(SO₃H)₂ doping methods on the thermoelectric properties of polyaniline (PANi), in this work, HPANi (in situ polymerization of aniline doped by HCl), HPANi/Cu (HPANi directly mixed with CuPc-(SO₃H)₂), CuPANi (in situ polymerization of aniline doped by CuPc-(SO₃H)₂) and CuHPANi (in situ polymerization of aniline co-doped by HCl and CuPc-(SO₃H)₂) were synthesized. CuPc-(SO₃H)₂ impedes carrier transport of HPANi/Cu, CuPANi and CuHPANi, however, their Seebeck coefficients are surprisingly enhanced. The Seebeck coefficients of HPANi/Cu (54.36 μ V K⁻¹) and CuHPANi (20.97 μ V K⁻¹) are more than 5.2 times and twice that of HPANi (10.40 μ V K⁻¹), respectively. Interestingly, the Seebeck coefficient of CuPANi is 30.92 μ V K⁻¹ at 300 K, while it becomes negative above 333 K and reaches −392.80 μ V K⁻¹ at 363 K. The structural characteristics were discussed to further reveal the thermoelectric performance differences among all the samples.

为了研究CuPc-(SO ₃ H) ₂掺杂方式对聚苯胺（PANi）热电性能的影响，本工作采用HPANi（ HCl掺杂苯胺的原位聚合）、HPANi/Cu（HPANi直接与CuPc混合） -(SO ₃ H) ₂ )、CuPANi( CuPc-(SO ₃ H) _{2掺杂苯胺的}原位聚合)和CuHPANi( HCl和CuPc-(SO ₃ H) ₂共掺杂苯胺的原位聚合)被合成了。CuPc-(SO ₃ H) ₂阻碍 HPANi/Cu、CuPANi 和 CuHPANi 的载流子传输，然而，它们的塞贝克系数却出人意料地增强。HPANi/Cu（54.36 μ VK ^-1）和CuHPANi（20.97 μ VK ^{-1 ）的塞贝克系数分别是HPANi（10.40 μ VK -1} ）的5.2倍以上和两倍。有趣的是，CuPANi 的塞贝克系数在 300 K 时为 30.92 μ VK ^-1，而在 333 K 以上变为负值，在 363 K 时达到 -392.80 μ VK ^-1。讨论了结构特征以进一步揭示所有材料之间的热电性能差异样品。