In order to realize high-quality through-hole (TH) interconnection with high aspect ratio, the mechanism of reverse pulse on TH electrodeposition process was systematically studied. In this paper, the mechanism of sodium thiazolinyl dithio propane sulfonate (SH110) was studied by electrochemical methods and molecular dynamics (MD) simulation. Under different direction of electric fields, the binding energies of SH110 and on Cu (111) are different. The behavior changes of SH110 in reverse pulse process under different convection conditions and the competitive adsorption relationship with other additives were explained. In addition, the results of TH electroplating verify the possibility of the additive system in practical application.

为了实现高纵横比的高质量通孔（TH）互连，系统研究了反向脉冲在TH电沉积过程中的机理。本文通过电化学方法和分子动力学（MD）模拟研究了噻唑啉基二硫代丙磺酸钠（SH110）的作用机理。在不同的电场方向下，SH110与Cu(111)的结合能不同。解释了SH110在不同对流条件下反向脉冲过程中的行为变化以及与其他添加剂的竞争吸附关系。此外，TH电镀结果验证了添加剂体系在实际应用中的可能性。