High temperature shape memory poly(amide-imide)s with strong mechanical robustness,Polymer Chemistry

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High temperature shape memory poly(amide-imide)s with strong mechanical robustness
Polymer Chemistry ( IF 4.1 ) Pub Date : 2022-08-15 , DOI: 10.1039/d2py00739h
Xingfeng Lei _{1,

2} , Guo Xiong _{1,

2} , Yuyang Xiao _{1,

2} , Tianhao Huang _{1,

2} , Xiangze Xin _{1,

2} , Shuyu Xue _{1,

2} , Qiuyu Zhang _{1,

2}

Affiliation

Shape memory polymers (SMPs) show tremendous application prospect in various fields owing to their stimuli responsiveness. However, their application in the high value-added aerospace industry still remains a great challenge, since it is problematic to engineer SMPs with both ideal shape memory properties and high heat resistance as well as outstanding mechanical strength. Herein, by incorporating amide hydrogen bonding interactions into a robust imide polymer backbone, a series of poly(amide-imide) hybridization networks have been fabricated, showcasing superior shape memory behavior together with impressive thermal stability and high mechanical strength, with a T_g above 300 °C and a tensile strength up to 108.3 MPa. Among all polymers, m-3FPAI exhibits outstanding heat resistance, high mechanical strength, low moisture sensitivity, excellent shape memory property and prominent multiple shape memory tolerance. After six consecutive cycles, a R_f still above 98.5% with a R_r ranging from 97.8% to 100% was observed, making m-3FPAI a promising candidate to be used in aerospace application.

中文翻译：

具有强机械强度的高温形状记忆聚（酰胺-酰亚胺）

形状记忆聚合物（SMPs）由于其刺激响应性而在各个领域显示出巨大的应用前景。然而，它们在高附加值航空航天工业中的应用仍然是一个巨大的挑战，因为设计具有理想形状记忆性能和高耐热性以及出色机械强度的 SMP 存在问题。在此，通过将酰胺氢键相互作用结合到坚固的酰亚胺聚合物骨架中，制造了一系列聚（酰胺-酰亚胺）杂化网络，展示出优异的形状记忆行为以及令人印象深刻的热稳定性和高机械强度，T _g高于300 °C 和高达 108.3 MPa 的抗拉强度。在所有聚合物中，m -3FPAI具有优异的耐热性、高机械强度、低湿敏性、优异的形状记忆性能和突出的多重形状记忆耐受性。在连续六个循环后，观察到R _f仍高于 98.5%，R _r范围在 97.8% 至 100% 之间，这使得m -3FPAI有望用于航空航天应用。

更新日期：2022-08-19

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