3R Electronics：弹性、可修复和可回收的软物质电子产品的可扩展制造,Advanced Materials

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3R Electronics：弹性、可修复和可回收的软物质电子产品的可扩展制造
Advanced Materials ( IF 27.4 ) Pub Date : 2022-06-13 , DOI: 10.1002/adma.202203266
Mahmoud Tavakoli ₁ , Pedro Alhais Lopes ₁ , Abdollah Hajalilou ₁ , André F Silva ₁ , Manuel Reis Carneiro ₂ , José Carvalheiro ₁ , João Marques Pereira ₁ , Aníbal T de Almeida ₁

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电子垃圾正在迅速变成另一场人为灾难。有人提出，只要它们达到与工业电子产品相同的成熟度，就可以通过具有弹性、损坏后可修复和可回收 (3R) 的软物质电子产品实现向更可持续未来的范式转变。这包括高分辨率图案化、多层实现、微芯片集成和自动化制造。在此，展示了一种用于微芯片集成的凝聚态软物质 3R 电子器件的新型材料结构和方法。3R 功能是通过双相液态金属基复合材料、具有非永久性物理交联的嵌段共聚物和用于材料回收的电化学技术实现的。此外，开发了一种用于可扩展电路图案化的自主激光图案化方法，其在秒内具有 <30 µm 的出色分辨率。BCP 的相移特性可用于蒸汽辅助“焊接”电路的修复和回收。该过程完全在室温下进行，从而为下一代绿色电子产品的各种热敏和可生物降解聚合物打开了大门。通过从表皮收集机械、电气、光学和热数据，展示了复杂的皮肤贴片的实施和回收，这些贴片具有嵌入式传感器、电极、天线和微芯片，可构建人体电生理信号的数字指纹。BCP 的相移特性可用于蒸汽辅助“焊接”电路的修复和回收。该过程完全在室温下进行，从而为下一代绿色电子产品的各种热敏和可生物降解聚合物打开了大门。通过从表皮收集机械、电气、光学和热数据，展示了复杂的皮肤贴片的实施和回收，这些贴片具有嵌入式传感器、电极、天线和微芯片，可构建人体电生理信号的数字指纹。BCP 的相移特性可用于蒸汽辅助“焊接”电路的修复和回收。该过程完全在室温下进行，从而为下一代绿色电子产品的各种热敏和可生物降解聚合物打开了大门。通过从表皮收集机械、电气、光学和热数据，展示了复杂的皮肤贴片的实施和回收，这些贴片具有嵌入式传感器、电极、天线和微芯片，可构建人体电生理信号的数字指纹。

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3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics

E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted “soldering” circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.

更新日期：2022-06-13

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