Abstract The micromechanical behavior of an Al/Al2Cu/Cu multilayer with characteristic crystal orientation during uniaxial tensile deformation was investigated by molecular dynamics. The simulation results showed that under tensile loading, the dislocation nucleates at the Cu/Al2Cu heterogeneous interface and moves toward the Cu layer along the {111} crystal plane. The deformation mechanism is intralayer confinement slip. As the dislocations proliferated, interactions between them occurred; resulting in the formation of insertion stacking faults and deformation twins in the Cu and Al layers. However, no dislocation lines were generated in the Al2Cu layer during tensile deformation. As the load increased, the stress concentration at the Al2Cu/Al interface led to the fracture of the complex. In addition, the microplastic deformation mechanism and mechanical properties of Al/Al2Cu/Cu composites at different temperatures and strain rates were significantly different. These results revealed the microdeformation mechanism of laminated composites containing brittle phases.

中文翻译：

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Cu/Al2Cu/Al复合材料界面微区受拉变形机理的分子动力学研究

摘要 通过分子动力学研究了具有特征晶体取向的Al/Al2Cu/Cu多层膜在单轴拉伸变形过程中的微观力学行为。模拟结果表明，在拉伸载荷作用下，位错在Cu/Al2Cu异质界面处形核，并沿{111}晶面向Cu层移动。变形机制为层内限制滑移。随着位错的扩散，它们之间发生了相互作用。导致在Cu和Al层中形成插入堆垛层错和变形孪晶。然而，在拉伸变形过程中，Al2Cu 层中没有产生位错线。随着载荷的增加，Al2Cu/Al 界面处的应力集中导致复合物的断裂。此外，Al/Al2Cu/Cu复合材料在不同温度和应变速率下的微塑性变形机制和力学性能存在显着差异。这些结果揭示了含有脆性相的层压复合材料的微变形机制。