As the request for ready-made food grows, it’s more important than ever to develop effective antimicrobial food packaging materials to assure food’s microbiological safety. The solvent casting method was used to create a chitosan (Cs)/polyvinyl alcohol (PVA) blend based active food packaging material enhanced with Fe₂O₃/TiO₂ (FeTiO₂) nanoparticles. The prepared films were characterized by TEM, XRD, FTIR, and ac conductivity. The structural alterations occurring in the nanocomposites are indicated by FTIR spectra and XRD investigations. The AC conductivity and dielectric characteristics of nanocomposites were dramatically improved as the nanoparticle loading was raised. The mechanical properties of blend/FeTiO2 nanocomposites films were better than pure blend film. The nanocomposites films had good antibacterial activity and mechanical properties, suggesting that they could be a viable alternative to non-biodegradable packaging material.