To reduce the adhesion and friction between polymer and mould surfaces during polymeric micro/nano structures replication, we have used tungsten disulfide (WS₂) nanosheets to fabricate high-performance nickel/WS₂ nanocomposite mould using electroforming. However, the aggregation of WS₂ nanosheets in the electroforming solution is a critical issue that influences the mechanical and tribological properties of the mould. In this study, we first propose a new strategy of combining anionic surfactant sodium dodecyl sulfate (SDS) and cationic surfactant cetyltrimethylammonium bromide (CTAB) to achieve uniform dispersion and incorporation of WS₂ nanosheets in the electroformed nickel mould. Our results indicate that appropriately designing the structure of CTAB-SDS complex can achieve a stable WS₂ dispersion, contributing to the uniform co-deposition of WS₂ nanosheets into nickel mould. The combination of high concentration of CTAB and SDS (1.0 g/L CTAB and 1.0 g/L SDS) significantly improved the dispersibility and incorporation of WS₂ into the nickel matrix, compared to individual SDS or CTAB. Consequently, the maximum hardness enhanced by 350% from 284 HV for pure nickel to 1280 HV for nickel/WS₂ nanocomposite mould, along with the coefficient of friction (COF) against the polymethyl methacrylate (PMMA) pin reducing from 0.75 to 0.31. It is also found that CTAB promotes particle encapsulation while SDS improves the particle dispersion but cannot control the particle incorporation. The surface wettability of nickel/WS₂ mould altered to hydrophobicity from hydrophilicity of nickel mould, where the adhesion-induced wear caused by polymer pin significantly reduced. Moreover, the surface roughness did not change much with the incorporation of WS₂ into the mould, which is acceptable for mould applications. Finally, the nickel/WS₂ nanocomposite mould was successfully fabricated via electroforming and its self-lubricating properties was validated by micro hot embossing PMMA microfluidic chips with good surface quality.

为了减少聚合物微/纳米结构复制过程中聚合物和模具表面之间的粘附和摩擦，我们使用二硫化钨 (WS ₂ ) 纳米片通过电铸制造高性能镍/WS ₂纳米复合模具。_{然而，WS 2}纳米片在电铸溶液中的聚集是影响模具的机械和摩擦学性能的关键问题。在本研究中，我们首先提出了一种结合阴离子表面活性剂十二烷基硫酸钠（SDS）和阳离子表面活性剂十六烷基三甲基溴化铵（CTAB）的新策略，以实现WS _{2的均匀分散和掺入。}电铸镍模具中的纳米片。我们的结果表明，适当设计CTAB-SDS复合物的结构可以实现稳定的WS ₂分散，有助于WS ₂纳米片在镍模具中的均匀共沉积。与单独的 SDS 或 CTAB 相比，高浓度 CTAB 和 SDS（1.0 g/L CTAB 和 1.0 g/L SDS）的组合显着提高了 WS _{2在镍基体中的分散性和结合。}因此，从纯镍的 284 HV 到镍/WS _{2的 1280 HV，最大硬度提高了 350%}纳米复合材料模具，以及与聚甲基丙烯酸甲酯 (PMMA) 销的摩擦系数 (COF) 从 0.75 降低到 0.31。还发现CTAB促进颗粒包封，而SDS改善颗粒分散但不能控制颗粒掺入。镍/WS ₂模具的表面润湿性从镍模具的亲水性转变为疏水性，其中由聚合物销引起的粘附引起的磨损显着降低。_{此外，在模具中加入 WS 2}后，表面粗糙度没有太大变化，这对于模具应用来说是可以接受的。最后，镍/WS ₂通过电铸成功制造了纳米复合模具，并通过微热压印PMMA微流控芯片验证了其自润滑性能，具有良好的表面质量。