用于 Bi2Te3 基热电器件的柔性薄片结构铝薄膜电极的高界面热稳定性,ACS Applied Materials & Interfaces

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用于 Bi2Te3 基热电器件的柔性薄片结构铝薄膜电极的高界面热稳定性
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2022-03-03 , DOI: 10.1021/acsami.2c00542
Yaling Wang ₁ , Pengcheng Zhu ₂ , Wenqiang Li ₁ , Xiaobiao Liu ₁ , Hui Li ₁ , Yuan Deng _{3,

4} , Ming Tan ₁

Affiliation

基于热电器件的环境热能采集对于下一代自供电可穿戴电子设备的发展具有重要意义。然而，电极/热电材料的刚性电极和界面扩散会导致热电器件的佩戴不适和性能下降。在这里，通过调节薄膜的微观结构和结晶度，制备了具有高导电性和优异可靠性的薄片结构 Al 薄膜电极。所制备的Al薄膜不仅在1000次弯曲循环后保持其坚固性，而且在经过3M胶带测试时不会从基材上分层，表现出优异的柔韧性和对基材的附着力。通过与双层 Cu/Bi 的退火界面进行比较₂ Te ₃薄膜，经过热处理的Al/Bi ₂ Te ₃薄膜的界面几乎没有元素扩散，表现出较高的界面热稳定性。此外，制备了基于Al薄膜电极的热电温度传感器。退火后的传感器灵敏度仍为线性，可稳定监测温度变化，可靠性高。这一发现可以为实现高度可靠的热电器件和柔性电子器件提供一种简便有效的策略，而无需任何额外的扩散屏障。

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High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi2Te3-Based Thermoelectric Devices

Environmental thermal energy harvesting based on thermoelectric devices is greatly significant to the advancement of next-generation self-powered wearable electronic devices. However, the rigid electrodes and interface diffusion of electrodes/thermoelectric materials would lead to the wearable discomfort and performance degradation of the thermoelectric device. Here, a flake-structured Al thin-film electrode with high conductivity and excellent reliability is prepared by regulating the microstructure and crystallinity of the films. The as-prepared Al thin film not only maintains its robustness after 1000 bending cycles but also does not delaminate from the substrate when subjected to the 3M tape test, exhibiting excellent flexibility and adhesion to substrate. By comparing with the annealed interface of the double-layer Cu/Bi₂Te₃ film, the interface of the heat-treated Al/Bi₂Te₃ film has almost no element diffusion, demonstrating high interfacial thermal stability. Moreover, a thermoelectric temperature sensor based on the Al thin-film electrode is prepared. The sensitivity of the annealed sensor is still linear, and it can stably monitor the temperature variation, showing high reliability. This discovery could provide a facile and effective strategy to achieving highly reliable thermoelectric devices and flexible electronic devices without any additional diffusion barriers.

更新日期：2022-03-03

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