具有增强隔热性和高使用温度的新型、柔性和透明薄膜聚酰亚胺气凝胶,Journal of Materials Chemistry C

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具有增强隔热性和高使用温度的新型、柔性和透明薄膜聚酰亚胺气凝胶
Journal of Materials Chemistry C ( IF 5.7 ) Pub Date : 2022-02-18 , DOI: 10.1039/d1tc06122d
Omid Aghababaei Tafreshi ₁ , Shahriar Ghaffari-Mosanenzadeh ₁ , Solmaz Karamikamkar ₁ , Zia Saadatnia ₁ , Sophie Kiddell ₁ , Chul B. Park ₁ , Hani E. Naguib _{1,

2}

Affiliation

聚酰亚胺 (PI) 气凝胶具有较高的使用温度、出色的隔热性、纳米多孔形态和低介电常数，具有用于下一代微电子器件和柔性电子器件的潜在能力。然而，主要挑战是控制溶胶-凝胶过程中的收缩，并开发具有改进的隔热性、降低的收缩和密度、厚度可控的薄膜，同时保持机械柔韧性。然而，大多数先前报道的 PI 气凝胶都是大块整体的形式，对其他配置的研究数量非常有限。在这项研究中，薄膜 PI 气凝胶是通过刮刀涂抹器。通过控制溶液粘度、浇注速度和叶片间距等工艺参数，制备出厚度和均匀度可控的薄膜PI气凝胶。PI 气凝胶网络是通过柔性 4,4'-二苯胺 (ODA) 和联苯四羧酸二酐 (BPDA) 单体的酰亚胺化形成的。在低聚物主链中用更刚性的 2,2'-二甲基联苯胺 (DMBZ) 代替 50 mol% 的 ODA，可使气凝胶具有更高的强度、更强的疏水性和更低的介电常数。1,3,5-Benzenetricarbonyl trichloride (BTC) 用于创建具有强完整性的交联网络。与以前使用的交联剂（TAB、OAPS 或 TAPP）相比，BTC 的成本更低，并且可以在市场上买到。进行了几种表征技术来检查制造的气凝胶的物理、化学、热、机械、电和光学特性。这些突出了 PI 气凝胶的多功能性，结合了出色的机械柔韧性（完全可弯曲和可卷曲）、出色的强度（压缩E = ∼1.9 MPa)、超低热导率 (27.5 mW m ^-1 )、重量轻 ( ρ = 0.089 g cm ^-3 )、优异的使用温度 (超过 560 °C)、超低介电常数 (∼2.7) 和出色的自- 灭火行为。作为制造的薄膜 PI 气凝胶的潜在应用，可以提出微电子封装。

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Novel, flexible, and transparent thin film polyimide aerogels with enhanced thermal insulation and high service temperature

Due to their high service temperature, excellent thermal insulation, nanoporous morphology, and low dielectric constant, polyimide (PI) aerogels have the potential capability to be used in the next generation of microelectronic devices and flexible electronics. The main challenge, however, is controlling the shrinkage during the sol–gel process, and developing thin films with improved thermal insulation, reduced shrinkage and density, and controllable thickness while maintaining mechanical flexibility. Yet, the majority of previously reported PI aerogels were in the form of bulk monolithic, with a very limited number of studies on other configurations. In this study, thin film PI aerogels are developed via a doctor blade applicator. Through control of processing parameters, namely solution viscosity, casting speed and inter-blade spacing, thin film PI aerogels with controllable thickness and uniformity are fabricated. The PI aerogel network is formed through imidization of flexible 4,4′-oxydianiline (ODA) and biphenyl-tetracarboxylic acid dianhydride (BPDA) monomers. Replacing 50 mol% of the ODA with a more rigid 2,2′-dimethylbenzidine (DMBZ) in the oligomer backbone gives aerogels with improved strength, enhanced hydrophobicity and lower dielectric constant. 1,3,5-Benzenetricarbonyl trichloride (BTC) is used to create a cross-linked network with strong integrity. Compared to previously used cross-linkers (TAB, OAPS, or TAPP), BTC has a lower cost and is commercially available. Several characterization techniques were performed to examine the physical, chemical, thermal, mechanical, electrical, and optical properties of the fabricated aerogels. These highlighted the multifunctionality of the PI aerogels, combining outstanding mechanical flexibility (fully bendable and rollable), excellent strength (compression E = ∼1.9 MPa), ultralow thermal conductivity (27.5 mW m⁻¹), lightweight (ρ = 0.089 g cm⁻³), superior service temperature (over 560 °C), ultralow dielectric constant (∼2.7), and excellent self-extinguishing behavior. As a potential application of the fabricated thin film PI aerogels, microelectronics packaging can be thus proposed.

更新日期：2022-02-18

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