In this paper, a facile method of fully additive process to manufacture copper lines on flexible polyimide (PI) substrates was developed. The selective modification on film, involving silver ammonia solution and plasma treatment, was performed to produce Ag particles that catalyze electroless copper plating. It was found that reductive aldehyde groups (R-CHO) were generated at the treated PI surface to reduce silver ammonia ion to Ag particles, which is supported by the of chemical and morphological characterizations. The obtained solid copper deposition demonstrates highly reliable features including limited oxidation, lower roughness and compact crystalline grain with low resistivity of 3.83 × 10^-6 Ω·cm. The practical fabricated flexible circuits with designed pattern have passed the mechanical and electrical property tests, confirming the compatibility of the developed additive method with the flexible PI substrate.

在本文中，开发了一种在柔性聚酰亚胺 (PI) 基板上制造铜线的全增材工艺的简便方法。对薄膜进行选择性改性，包括银氨溶液和等离子体处理，以产生催化化学镀铜的银颗粒。发现在处理过的 PI 表面产生还原性醛基 (R-CHO) 以将银氨离子还原为 Ag 颗粒，这得到了化学和形态学表征的支持。所获得的固体铜沉积表现出高度可靠的特性，包括有限的氧化、较低的粗糙度和致密的晶粒，电阻率低至 3.83 × 10 ^-6Ω·cm。实际制造的具有设计图案的柔性电路通过了机械和电气性能测试，证实了所开发的添加剂方法与柔性 PI 基板的兼容性。