低介电常数氟化环氧树脂的制备及性能,Journal of Applied Polymer Science

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低介电常数氟化环氧树脂的制备及性能
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2022-01-06 , DOI: 10.1002/app.52132
Jinzhao Li ₁ , Mengdi Chen ₁ , Yuechuan Wang ₁

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对具有改进介电性能的电子材料的需求正在增加。降低介电常数的方法之一是引入氟原子。本文以氟苯为原料合成了一种含氟量为 45.7 wt% 的新型氟化环氧树脂（2,4-双（1,1,1,3,3,3-六氟异丙基）氟苯的二缩水甘油醚（FB-EP））。、表氯醇和六氟丙酮。所需单体的结构通过 NMR 和 FTIR 进行了表征。环氧树脂 FB-EP 通过与六氢邻苯二甲酸酐 (HHPA) 共聚和在三氟化硼乙胺 (BF ₃MEA），分别。与普通二缩水甘油醚环氧树脂（BADGE）相比，研究了氟化环氧树脂的固化反应动力学和固化材料的性能。固化活化能结果表明FB-EP作为BADGE具有反应性，FB-EP上的四-三氟甲基对环氧基团的阳离子聚合反应没有负面影响。固化后的 FB-EP 材料具有较低的吸湿性，尤其是在 8.2-12.4 GHz 频率范围内具有较低的介电常数 ( D _k , 2.23) 和较低的介电损耗 ( D _f , 0.011)。本文为氟环氧树脂作为先进电子材料的进一步研究奠定了基础。

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Preparation and properties of a fluorinated epoxy resin with low dielectric constant

Demand for electronic materials with improved dielectric properties are increasing. One of the ways to reduce the dielectric constant is to incorporate fluorine atoms. In this article, a novel fluorinated epoxy resin (diglycidol ether of 2,4-bis (1,1,1,3,3,3-hexafluoroisopropyl) fluorobenzene (FB-EP)) with 45.7 wt% fluorine content was synthesized from fluorobenzene, epichlorohydrin and hexafluoroacetone. The structures of desired monomers were characterized by NMR and FTIR. The epoxy resin FB-EP was cured by copolymerization with hexahydrophthalic anhydride (HHPA) and by homopolymerization catalyzed with boron trifluoride ethylamine (BF₃MEA), respectively. The curing reaction kinetics of the fluorinated epoxy and the properties of the cured materials were studied in comparison with those of common diglycidol ether epoxy resin (BADGE). The results of curing activation energy indicate that FB-EP is reactive as the BADGE, and the four-trifluoromethyl groups on FB-EP do not negatively affect the cationic polymerization reactivity of the epoxy groups. The cured FB-EP materials had lower moisture absorption, and especially lower dielectric constant (D_k, 2.23) and lower dielectric loss (D_f, 0.011) in the frequency range of 8.2–12.4 GHz. This article provides a base for further study of fluorinated epoxy resin as advanced electronic materials.

更新日期：2022-01-06

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