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Effect of Thiourea on Copper Cathode from Simulated Leachate of Copper and Cadmium Residues by Cyclone Electrowinning Technology
Journal of Sustainable Metallurgy ( IF 2.5 ) Pub Date : 2021-11-23 , DOI: 10.1007/s40831-021-00448-x
Jihao Guo 1 , Bo Li 1 , Yonggang Wei 1 , Hua Wang 1
Affiliation  

The leachate of copper and cadmium residues is treated by cyclone electrowinning technology. The resulting copper cathodes are prone to the formation of nodules and dendritic copper particles during the recovery process. The addition of a suitable dose of thiourea (TU) can alter the preferential orientation of the crystals to refine the copper particles. A suitable current density can stabilize crystal growth fluctuations otherwise caused by the limited diffusion rate. In the study, it was found that the horizontal spacing of copper particles increases with low thiourea concentrations and that the vertical length of copper particles increases at high thiourea concentrations. At low current densities, defects such as pores, depressions, and bumps exist on the surface of the copper particles. At high current densities, the copper particles aggregate into cauliflower-like and dendritic shapes in turn. Optimum conditions are obtained with c(TU) = 3 mg/L and a current density of 250 A/m2, at which point the copper cathode product is smooth and dense.

Graphical Abstract



中文翻译:

硫脲对旋风电积技术模拟铜镉渣浸出液铜阴极的影响

铜渣和镉渣浸出液采用旋风电积技术处理。得到的阴极铜在回收过程中容易形成结核和树枝状铜颗粒。添加合适剂量的硫脲 (TU) 可以改变晶体的优先取向以细化铜颗粒。合适的电流密度可以稳定晶体生长波动,否则由有限的扩散速率引起。在研究中发现,铜颗粒的水平间距随着硫脲浓度低而增加,而铜颗粒的垂直长度在硫脲浓度高时增加。在低电流密度下,铜颗粒表面存在气孔、凹陷、凸起等缺陷。在高电流密度下,铜颗粒依次聚集成菜花状和树枝状。最佳条件是在 c(TU) = 3 mg/L 和 250 A/m 的电流密度下获得的2、此时阴极铜产品光滑致密。

图形概要

更新日期:2021-11-23
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