To save test time and cost, spreading area method and wetting balance method were used to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different parameters and explore the correlation between spreadability and wetting driving force of the composite solder. The results showed that the composite solder had good spreadability on the Cu substrate under 270–280 °C and water-clean flux, and they had good wetting adaptability to Cu wire under the tin bath temperature of 270–280 °C, dipping time of 6 s and dipping speed of 20 mm/s. The results satisfied the requirements of production in micro-connection field. The dynamic spreading processes of Ni-GNSs/SnAgCuRE composite solder consisted of three stages: initial slow shrinkage, rapid expansion and gradual equilibrium. Added appropriate amount of Ni-GNSs into the solder alloy, they adsorbed on the surface of Ag₃Sn particles to form a precursor film at the three-phase interface, which was conducive to spread. The correlation equation between spreadability and wetting driving force of composite solder was established. According to the spreading area of the composite solder on the Cu substrate, the wetting driving force and wetting balance of the immersion wetting processes could be analyzed and vice versa.

为了节省测试时间和成本，采用铺展面积法和润湿平衡法研究了Ni-GNSs/SnAgCuRE复合焊料在不同参数下的润湿特性，探索了复合焊料铺展性与润湿驱动力的相关性。结果表明，复合焊料在 270-280 ℃下在 Cu 基板上具有良好的铺展性和水洗助焊剂，在 270-280 ℃的锡浴温度下，对 Cu 线具有良好的润湿适应性，浸渍时间为6 秒，浸渍速度为 20 毫米/秒。结果满足微连接领域的生产要求。Ni-GNSs/SnAgCuRE复合焊料的动态扩展过程包括三个阶段：初始缓慢收缩、快速膨胀和逐渐平衡。₃ Sn颗粒在三相界面形成前驱体薄膜，有利于扩散。建立了复合焊料的铺展性与润湿驱动力的相关方程。根据复合焊料在Cu基板上的铺展面积，可以分析浸湿过程的润湿驱动力和润湿平衡，反之亦然。