Construction of 3D Conductive Network in Liquid Gallium with Enhanced Thermal and Electrical Performance,Advanced Materials Technologies

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Construction of 3D Conductive Network in Liquid Gallium with Enhanced Thermal and Electrical Performance
Advanced Materials Technologies ( IF 6.4 ) Pub Date : 2021-10-27 , DOI: 10.1002/admt.202100970
Wenkui Xing ₁ , Shen Chen ₁ , Han Wang ₁ , Wendong Liu ₁ , Jiashu Zheng ₁ , Feiyu Zheng ₁ , Xiaomin Li ₂ , Peng Tao ₁ , Wen Shang ₁ , Benwei Fu ₁ , Jianbo Wu ₁ , Chengyi Song ₁ , Baowen Li ₃ , Tao Deng ₁

Affiliation

This paper reports the generation of 3D thermal and electrical conductive graphene network in gallium-based liquid metal (LM) via a simple one-step ball-milling approach. In this work, 2D graphene nanoplates and their derivatives were employed to construct 3D thermal and electrical conductive filler networks. It is demonstrated that the obtained composite exhibits the highest 3D thermal conductivity (44.6 W m⁻¹ K⁻¹) among the other gallium-based LM composites with 2D inorganic nanofillers and distinguished electrical conductivity (8.3 S µm⁻¹) among gallium-based LM composites at present. The enhanced thermal conductivity and wettability of gallium-based composite lead to its beneficial usage as thermal interface materials with exquisite texture for LED chip heat dissipation. The electrochemical and magnetic experiments confirm that these LM-based composites can also be controlled under external electrical or magnetic field, which potentially can help extend their application in external field-driven systems. The findings of this work offer new insight in designing LM-based composites with enhanced thermal, electrical, and magnetic properties for a wide range of applications, including thermal management systems, 3D printing, flexible conductors, soft robotic systems, and wearable energy technologies.

中文翻译：

在液态镓中构建具有增强热电性能的 3D 导电网络

本文报道了通过简单的一步球磨方法在镓基液态金属 (LM) 中生成 3D 导热和导电石墨烯网络。在这项工作中，2D 石墨烯纳米板及其衍生物被用于构建 3D 导热和导电填料网络。结果表明，所获得的复合材料在其他具有 2D 无机纳米填料的镓基 LM 复合材料中表现出最高的 3D 热导率（44.6 W m ^-1 K ^-1）和出色的电导率（8.3 S µ m ^-1）目前在镓基LM复合材料中。镓基复合材料增强的导热性和润湿性使其可用作具有精美纹理的热界面材料，用于 LED 芯片散热。电化学和磁性实验证实，这些基于 LM 的复合材料也可以在外部电场或磁场下进行控制，这可能有助于扩展它们在外部场驱动系统中的应用。这项工作的发现为设计具有增强的热、电和磁性能的 LM 基复合材料提供了新的见解，适用于广泛的应用，包括热管理系统、3D 打印、柔性导体、软机器人系统和可穿戴能源技术。

更新日期：2021-10-27

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