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Order of magnitude enhancement of inherently selective atomic layer deposition of zirconia on silicon without deposition on copper: The role of precursor
Vacuum ( IF 3.8 ) Pub Date : 2021-10-16 , DOI: 10.1016/j.vacuum.2021.110686
Soumya Saha 1 , Gregory Jursich 1, 2 , Abhijit H. Phakatkar 1 , Tolou Shokuhfar 1 , Christos G. Takoudis 1, 3
Affiliation  

Zirconia atomic layer deposition (ALD) using zirconium 2-methyl 2-butoxide (ZMB) and ethanol is reported for the first time. The process selectively deposits a uniform ZrO2 film on silicon with a high deposition rate (∼2 Å/cycle), without any deposition on copper at a relatively low temperature (200 °C) and up to at least 200 cycles. This is the largest thickness of inherently surface selective ZrO2 ALD ever reported (∼400 Å) and is at least 10 times more selective than that achieved using a similar deposition process but with a different precursor, tris(dimethylamino)cyclopentadienyl Zirconium (ZyALD™). The selectively deposited ZrO2 films were characterized using spectral ellipsometry, X-ray photoelectron spectroscopy, extended X-ray absorption fine structure spectroscopy (EXAFS), atomic force microscopy and energy dispersive spectroscopy obtained during scanning electron microscopy and scanning transmission electron microscopy. Surface characterization techniques employed here confirmed the chemical nature and topography of the deposited ZrO2, whereas EXAFS showed the ZrO2 to be amorphous on silicon having local bonding structure similar to that of ZrO2 deposited with ZyALD™ precursor.



中文翻译:

氧化锆固有选择性原子层沉积在硅上而不在铜上沉积的数量级增强:前体的作用

首次报道了使用2-甲基2-丁醇锆(ZMB) 和乙醇的氧化锆原子层沉积 (ALD) 。该工艺以高沉积速率(~2 Å/循环)选择性地在硅上沉积均匀的 ZrO 2膜,而在相对较低的温度(200°C)和至少 200 次循环下不会在铜上进行任何沉积。这是迄今为止报道的最大厚度的固有表面选择性 ZrO 2 ALD(~400 Å),并且比使用类似沉积工艺但使用不同前体(二甲氨基)环戊二烯基锆 (ZyALD™)实现的选择性至少高 10 倍)。选择性沉积的 ZrO 2使用光谱椭偏仪、X 射线光电子能谱、扩展 X 射线吸收精细结构光谱 (EXAFS)、原子力显微镜和在扫描电子显微镜和扫描透射电子显微镜中获得的能量色散光谱对薄膜进行表征。这里采用的表面表征技术证实了沉积的 ZrO 2的化学性质和形貌,而 EXAFS 显示 ZrO 2在硅上是无定形的,具有类似于用 ZyALD™ 前体沉积的 ZrO 2 的局部键合结构。

更新日期:2021-10-17
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