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Synthesis and properties of colorless copolyimides derived from 4,4′-diaminodiphenyl ether-based diamines with different substituents
Polymer Chemistry ( IF 4.1 ) Pub Date : 2021-08-03 , DOI: 10.1039/d1py00633a
Ruhe Lian 1, 2, 3, 4, 5 , Xingfeng Lei 1, 2, 3, 4, 5 , Yuyang Xiao 1, 2, 3, 4, 5 , Shuyu Xue 1, 2, 3, 4, 5 , Guo Xiong 1, 2, 3, 4, 5 , Zixiang Zhang 1, 2, 3, 4, 5 , Dong Yan 1, 2, 3, 4, 5 , Qiuyu Zhang 1, 2, 3, 4, 5
Polymer Chemistry ( IF 4.1 ) Pub Date : 2021-08-03 , DOI: 10.1039/d1py00633a
Ruhe Lian 1, 2, 3, 4, 5 , Xingfeng Lei 1, 2, 3, 4, 5 , Yuyang Xiao 1, 2, 3, 4, 5 , Shuyu Xue 1, 2, 3, 4, 5 , Guo Xiong 1, 2, 3, 4, 5 , Zixiang Zhang 1, 2, 3, 4, 5 , Dong Yan 1, 2, 3, 4, 5 , Qiuyu Zhang 1, 2, 3, 4, 5
Affiliation
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Colorless polyimide (PI) films with outstanding mechanical and thermal properties are highly demanded in flexible electronics. Herein three 4,4′-diaminodiphenyl ether (ODA)-based diamines with different substituents (–CH3, –CF3) and substitution positions (ortho and meta positions) were synthesized. After reacting with a combination of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) in a typical sequential reaction manner, four highly transparent copolyimide films with excellent mechanical strength, high heat-resistance and superior fracture toughness were fabricated. A copolyimide film made using m-3F-ODA exhibits a fairly high transmittance at 400 nm of up to 86.8%, tensile strength as high as 102 MPa, tensile modulus of 2.76 GPa and glass transition temperature above 308 °C. The desirable solubility enables the prepared PIs to be readily cast from solution into robust films. All these encouraging results make these PI films potential substrates in place of ultrathin glass in flexible displays.
中文翻译:
不同取代基的4,4'-二氨基二苯醚基二胺衍生的无色共聚酰亚胺的合成及性能
具有出色机械和热性能的无色聚酰亚胺 (PI) 薄膜在柔性电子产品中非常受欢迎。在此合成了三种具有不同取代基(–CH 3、–CF 3)和取代位置(邻位和间位)的基于4,4'-二氨基二苯醚 ( ODA ) 的二胺。与 1,2,4,5-环己烷四甲酸二酐 ( CHDA ) 和 4,4'-(六氟异亚丙基)二邻苯二甲酸酐 ( 6FDA )的组合反应后)以典型的顺序反应方式制备了四种具有优异机械强度、高耐热性和优异断裂韧性的高透明共聚酰亚胺薄膜。使用m -3F-ODA制成的共聚酰亚胺薄膜在 400 nm 处具有高达 86.8% 的相当高的透射率,拉伸强度高达 102 MPa,拉伸模量为 2.76 GPa,玻璃化转变温度高于 308 °C。理想的溶解度使制备的 PI 能够很容易地从溶液中浇铸成坚固的薄膜。所有这些令人鼓舞的结果使这些 PI 薄膜成为替代柔性显示器中超薄玻璃的潜在基板。
更新日期:2021-08-09
中文翻译:
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不同取代基的4,4'-二氨基二苯醚基二胺衍生的无色共聚酰亚胺的合成及性能
具有出色机械和热性能的无色聚酰亚胺 (PI) 薄膜在柔性电子产品中非常受欢迎。在此合成了三种具有不同取代基(–CH 3、–CF 3)和取代位置(邻位和间位)的基于4,4'-二氨基二苯醚 ( ODA ) 的二胺。与 1,2,4,5-环己烷四甲酸二酐 ( CHDA ) 和 4,4'-(六氟异亚丙基)二邻苯二甲酸酐 ( 6FDA )的组合反应后)以典型的顺序反应方式制备了四种具有优异机械强度、高耐热性和优异断裂韧性的高透明共聚酰亚胺薄膜。使用m -3F-ODA制成的共聚酰亚胺薄膜在 400 nm 处具有高达 86.8% 的相当高的透射率,拉伸强度高达 102 MPa,拉伸模量为 2.76 GPa,玻璃化转变温度高于 308 °C。理想的溶解度使制备的 PI 能够很容易地从溶液中浇铸成坚固的薄膜。所有这些令人鼓舞的结果使这些 PI 薄膜成为替代柔性显示器中超薄玻璃的潜在基板。