用于提高热可靠性的直接镀铜氮化铝基板的机械设计与分析,Microelectronics Reliability

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用于提高热可靠性的直接镀铜氮化铝基板的机械设计与分析
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2015-12-01 , DOI: 10.1016/j.microrel.2015.08.010
M.Y. Tsai , P.S. Huang , C.H. Lin , C.T. Wu , S.C. Hu

摘要具有高导热性的直接镀铜 (DPC) 氮化铝 (AlN) 基板可以很好地替代传统的氧化铝 (Al2O3) 基板，从而在大功率模块应用中实现更好的散热。然而，由于较高的热膨胀系数与铜材料不匹配，DPC AlN 基板在热循环过程中会在 Cu 膜的边角处发生 AlN 裂纹。本研究旨在解决 DPC AlN 衬底在热循环过程中的 AlN 裂纹问题，并进一步为机械设计提供重要参数，以确保良好的热可靠性。在分析之前，对经过回流焊加热和冷却的Cu-AlN双材料板进行面外变形测量，以评估镀Cu膜的材料特性以及制造和回流焊过程中引起的残余应力。结果显示了在回流焊加热和冷却过程中 Cu-AlN 板的滞后和类似包辛格的行为。经验证的有限元模拟还发现，Cu膜楔角、长度和厚度显着影响热循环加载过程中AlN的最大第一主应力，以及基于最大第一主应力的预测失效模式和位置与实验观察一致。其他因素，如单面和双面铜膜（类似三明治结构）基板，

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Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability

Abstract Direct-plated-copper (DPC) aluminum nitride (AlN) substrate with a high thermal conductivity can provide a good alternative to conventional aluminum oxide (Al2O3) substrate for better heat dissipation in the high-power module applications. However, the DPC AlN substrate suffers AlN crack initiating at the edge corner of Cu film during thermal cycling, due to the higher thermal expansion coefficient mismatch with copper material. This study is to resolve the AlN crack problem of DPC AlN substrate during thermal cycling and further to provide important parameters for mechanical design for ensuring good thermal reliability. Prior to the analysis, the out-of-plane deformation measurement of a Cu-AlN bi-material plate subject to the solder reflow heating and cooling is conducted for evaluating the material property of the plated Cu film and residual stresses induced from the manufacturing and solder reflow process. The results show the hysteresis and Bauschinger-like behaviors for the Cu-AlN plate during the solder-reflow heating and cooling. It is also found from the validated finite element simulation that the Cu-film wedge angle, length, and thickness significantly affect the maximum 1st principal stress of AlN during thermal cyclic loading, and the predicted failure mode and location based on the maximum 1st principal stress is consistent with experimental observation. The other factors, such as single-side and double-side Cu-film (sandwich-structure-alike) substrates, length difference of Cu films, and the nonlinear property of Cu film will be presented and discussed in detail as well.

更新日期：2015-12-01

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