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Cyanate ester resins toughened with epoxy-terminated and fluorine-containing polyaryletherketone
Polymer Chemistry ( IF 4.1 ) Pub Date : 2021-6-7 , DOI: 10.1039/d1py00597a Chaofan Wang 1, 2, 3, 4, 5 , Yusheng Tang 1, 2, 3, 4, 5 , Yuxiao Zhou 1, 2, 3, 4, 5 , Yanyao Zhang 1, 2, 3, 4, 5 , Jie Kong 1, 2, 3, 4, 5 , Junwei Gu 1, 2, 3, 4, 5 , Junliang Zhang 1, 2, 3, 4, 5
Polymer Chemistry ( IF 4.1 ) Pub Date : 2021-6-7 , DOI: 10.1039/d1py00597a Chaofan Wang 1, 2, 3, 4, 5 , Yusheng Tang 1, 2, 3, 4, 5 , Yuxiao Zhou 1, 2, 3, 4, 5 , Yanyao Zhang 1, 2, 3, 4, 5 , Jie Kong 1, 2, 3, 4, 5 , Junwei Gu 1, 2, 3, 4, 5 , Junliang Zhang 1, 2, 3, 4, 5
Affiliation
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Cyanate ester resins are widely utilized in high-performance printed circuit boards, radar radomes, communication satellites, and other fields. However, the poor toughness after curing due to the highly cross-linked and symmetrical triazine ring structure severely limits their wide application. Herein, a novel epoxy-terminated and fluorine-containing polyaryletherketone (EFPAEK) synthesized from bisphenol AF, difluorobenzophenone, and epichlorohydrin was applied to modify the bisphenol A dicyanate ester (BADCy) resin. The results showed that the EFPAEK/BADCy resin toughened with 20 wt% of EFPAEK displayed the best comprehensive properties. The dielectric constant and the dielectric loss tangent values at 1 MHz were 2.64 and 0.006, respectively, which were much lower than those of the pure BADCy resin (3.09 and 0.008). In addition, the flexural strength and impact strength of the corresponding EFPAEK/BADCy resin increased significantly to 131.8 MPa and 30.6 kJ m−2, respectively, which were 32.5% and 159.3% higher compared to the pure BADCy resin (99.5 MPa and 11.8 kJ m−2). Besides, the modified BADCy resin still maintained high thermal stability, by showing the highest heat resistance index of 219.5 °C, which increased by 4.2% compared with the pure BADCy resin (210.6 °C). Moreover, the addition of EFPAEK improved the bonding strength. The maximum bonding strength of the EFPAEK/BADCy resin was 22.2 MPa, which was 91.4% higher compared to that of the pure BADCy resin (11.6 MPa). Additionally, the EFPAEK/BADCy resin demonstrated improved water resistance as the minimum water absorption rate decreased by 30.9% compared to that of the pure BADCy resin.
中文翻译：
用环氧基和含氟聚芳醚酮增韧的氰酸酯树脂
氰酸酯树脂广泛应用于高性能印刷电路板、雷达天线罩、通信卫星等领域。然而，由于三嗪环结构的高度交联和对称，固化后韧性差，严重限制了其广泛应用。在此，由双酚 AF、二氟二苯甲酮和环氧氯丙烷合成的新型端环氧基含氟聚芳醚酮 (EFPAEK) 用于改性双酚 A 二氰酸酯 (BADCy) 树脂。结果表明，EFPAEK/BADCy树脂以20wt%的EFPAEK增韧，综合性能最好。1 MHz 下的介电常数和介电损耗角正切值分别为 2.64 和 0.006，远低于纯 BADCy 树脂（3.09 和 0.008）。此外，-2，分别比纯 BADCy 树脂（99.5 MPa 和 11.8 kJ m -2）高 32.5% 和 159.3%。此外，改性BADCy树脂仍保持较高的热稳定性，表现出最高的耐热指数219.5°C，比纯BADCy树脂（210.6°C）提高了4.2%。此外，EFPAEK的加入提高了结合强度。EFPAEK/BADCy 树脂的最大结合强度为 22.2 MPa，比纯 BADCy 树脂（11.6 MPa）高 91.4%。此外，与纯 BADCy 树脂相比，EFPAEK/BADCy 树脂的最小吸水率降低了 30.9%，因此具有更好的耐水性。
更新日期：2021-06-17
中文翻译：
用环氧基和含氟聚芳醚酮增韧的氰酸酯树脂
氰酸酯树脂广泛应用于高性能印刷电路板、雷达天线罩、通信卫星等领域。然而，由于三嗪环结构的高度交联和对称，固化后韧性差，严重限制了其广泛应用。在此，由双酚 AF、二氟二苯甲酮和环氧氯丙烷合成的新型端环氧基含氟聚芳醚酮 (EFPAEK) 用于改性双酚 A 二氰酸酯 (BADCy) 树脂。结果表明，EFPAEK/BADCy树脂以20wt%的EFPAEK增韧，综合性能最好。1 MHz 下的介电常数和介电损耗角正切值分别为 2.64 和 0.006，远低于纯 BADCy 树脂（3.09 和 0.008）。此外，-2，分别比纯 BADCy 树脂（99.5 MPa 和 11.8 kJ m -2）高 32.5% 和 159.3%。此外，改性BADCy树脂仍保持较高的热稳定性，表现出最高的耐热指数219.5°C，比纯BADCy树脂（210.6°C）提高了4.2%。此外，EFPAEK的加入提高了结合强度。EFPAEK/BADCy 树脂的最大结合强度为 22.2 MPa，比纯 BADCy 树脂（11.6 MPa）高 91.4%。此外，与纯 BADCy 树脂相比，EFPAEK/BADCy 树脂的最小吸水率降低了 30.9%，因此具有更好的耐水性。
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