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The chemistry of the additives in an acid copper electroplating bath
Journal of Electroanalytical Chemistry ( IF 4.1 ) Pub Date : 1992-10-01 , DOI: 10.1016/0022-0728(92)80421-y
John P. Healy , Derek Pletcher , Mark Goodenough

Abstract It is widely believed that 4,5-dithiaoctane-1,8-disulphonic acid, [SCH2CH2CH2SO3H]2, a common brightener in acid copper electroplating baths, is not stable in the electroplating bath even when it is not in operation. This has been confirmed and the mechanism of the decomposition process is defined by investigating the chemistry and electrochemistry of each species present in the bath. It is shown that the complex, CU(I)SCH2CH2CH2SO3H has an important role in determining the behaviour of the electroplating bath.

中文翻译:

酸性铜电镀液中添加剂的化学性质

摘要 人们普遍认为,4,5-二硫辛烷-1,8-二磺酸[SCH2CH2CH2SO3H]2 是酸性铜电镀液中常见的光亮剂,即使在不运行时在电镀液中也不稳定。这已经得到证实,分解过程的机制是通过研究浴中存在的每个物种的化学和电化学来定义的。结果表明,复合物 CU(I)SCH2CH2CH2SO3H 在决定电镀液的行为方面具有重要作用。
更新日期:1992-10-01
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