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High-temperature polymers with record-high breakdown strength enabled by rationally designed chain-packing behavior in blends
Matter ( IF 17.3 ) Pub Date : 2021-05-26 , DOI: 10.1016/j.matt.2021.04.026
Qiyan Zhang , Xin Chen , Bing Zhang , Tian Zhang , Wengchang Lu , Zhe Chen , Ziyu Liu , Seong H. Kim , Brian Donovan , Ronald J. Warzoha , Enrique D. Gomez , J. Bernholc , Q.M. Zhang

Polymers with high dielectric breakdown strength (Eb) over a broad temperature range are vital for many applications. The presence of weak points, such as voids and free volume, severely limit the Eb of many high-temperature polymers. Here, we present a general strategy to reduce these weak points by exploiting interchain electrostatic forces in polymer blends. We show that the strong interchain electrostatic interaction between two high-temperature polymers in blends of polyimide (PI) with poly(ether imide) (PEI) yields an extended polymer chain conformation, resulting in dense chain packing and a corresponding decrease in weak spots in the polymers. This leads to a greater than 65% enhancement of Eb at room temperature and 35% enhancement at 200°C. In conjunction with results from blends of PI/poly(1,4-phenylene ether-sulfone) (PSU) and blends of PEI/PSU, we show that this previously unexplored molecular engineering strategy is efficient and straightforward in minimizing weak points in dielectric polymers.



中文翻译:

通过合理设计的共混链堆积行为实现具有创纪录高击穿强度的高温聚合物

在很宽的温度范围内具有高介电击穿强度 (E b ) 的聚合物对于许多应用至关重要。空隙和自由体积等弱点的存在严重限制了许多高温聚合物的 E b。在这里,我们提出了一种通过利用聚合物共混物中的链间静电力来减少这些弱点的一般策略。我们表明,聚酰亚胺 (PI) 与聚醚酰亚胺 (PEI) 共混物中的两种高温聚合物之间的强链间静电相互作用产生了延伸的聚合物链构象,导致密集的链堆积和相应的弱点减少聚合物。这导致 E b 的增强超过 65%室温和 200°C 增强 35%。结合 PI/聚(1,4-亚苯基醚砜)(PSU)混合物和 PEI/PSU 混合物的结果,我们表明这种以前未探索的分子工程策略在最大限度地减少介电聚合物的弱点方面是有效和直接的.

更新日期:2021-07-07
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