All-organic polymer blend dielectrics of poly (arylene ether urea) and polyimide: Toward high energy density and high temperature applications,Journal of Polymer Science

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All-organic polymer blend dielectrics of poly (arylene ether urea) and polyimide: Toward high energy density and high temperature applications
Journal of Polymer Science ( IF 3.9 ) Pub Date : 2021-05-07 , DOI: 10.1002/pol.20200725
Aftab Ahmad _{1,

2} , Hui Tong ₁ , Tao Fan _{1,

2} , Ju Xu _{1,

2}

Affiliation

The development of high-performance dielectric films with high energy density and temperature stability is extremely desired for modern electronics and power systems. Herein, a simple and low-cost approach is proposed to fabricate all-organic blend films prepared from poly (arylene ether urea) (PEEU) and polyimide (PI) via solution casting and thermal imidization process. The incorporation of PEEU in PI matrix significantly improved dielectric breakdown strength and dielectric constant of PI. More precisely, blend film with 15 wt% PEEU exhibited highest energy density 5.14 J/cm³ at 495.65 MV/m, with enhanced dielectric constant of 4.73 and very low dissipation factor of 0.299%. Furthermore, the dielectric properties of the PEEU/PI blend displayed wonderful temperature stability in the range of − 50–+ 250°C, and great frequency stability between 10 and 10⁶ Hz. The blend film also exhibited excellent heat resistance and presented valuable potential in thin film capacitors for high voltage direct current system.

中文翻译：

聚（亚芳基醚脲）和聚酰亚胺的全有机聚合物共混电介质：走向高能量密度和高温应用

现代电子和电力系统非常需要开发具有高能量密度和温度稳定性的高性能介电薄膜。在此，提出了一种简单且低成本的方法，通过溶液浇铸和热酰亚胺化工艺制备由聚（亚芳基醚脲）（PEEU）和聚酰亚胺（PI）制备的全有机共混薄膜。PEEU在PI基体中的加入显着提高了PI的介电击穿强度和介电常数。更准确地说，含有 15 wt% PEEU 的共混膜表现出最高的能量密度 5.14 J/cm ³在 495.65 MV/m，具有 4.73 的增强介电常数和 0.299% 的极低损耗因数。此外，PEEU/PI 混合物的介电性能在 − 50–+ 250°C 范围内显示出极好的温度稳定性，在 10 到 10 ⁶ Hz之间具有出色的频率稳定性。该混合膜还表现出优异的耐热性，并在高压直流系统的薄膜电容器中具有宝贵的潜力。

更新日期：2021-07-02

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