当前位置：
X-MOL 学术
›
Macromol. Mater. Eng.
›
论文详情
Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High-Frequency Flexible Circuit Board Application
Macromolecular Materials and Engineering ( IF 4.2 ) Pub Date : 2021-04-19 , DOI: 10.1002/mame.202100086 Tangjian Cheng 1, 2, 3 , Genpin Lv 1 , Yitao Li 3 , Hao Yun 3 , Lingfei Zhang 3 , Yongmao Deng 3 , Liping Lin 3 , Xiangjun Luo 1 , Junmin Nan 2
Macromolecular Materials and Engineering ( IF 4.2 ) Pub Date : 2021-04-19 , DOI: 10.1002/mame.202100086 Tangjian Cheng 1, 2, 3 , Genpin Lv 1 , Yitao Li 3 , Hao Yun 3 , Lingfei Zhang 3 , Yongmao Deng 3 , Liping Lin 3 , Xiangjun Luo 1 , Junmin Nan 2
Affiliation
|
The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm−1, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.
中文翻译：
用于高频柔性电路板应用的低介电聚酰亚胺/氟化乙烯丙烯 (PI/FEP) 纳米复合薄膜
低介电聚合物薄膜在高频电路板中作为介电绝缘材料的应用受到了极大的关注，而由于氟化或刚性结构导致对铜箔的附着力弱和加工性差，限制了其高频应用。在这项工作中，开发了用于高频柔性电路板应用的低介电和高粘合性聚酰亚胺/氟化乙丙烯（PI/FEP）纳米复合薄膜。结果表明，氟碳表面活性剂可以显着提高FEP在PI基材中的分散性，从而使PI/FEP纳米复合薄膜表现出优异的力学性能，包括拉伸强度提高到46.6 MPa，断裂伸长率提高到13.7% . 重要的是，在 10 GHz 的高频下，60 wt% FEP 填充的 PI 纳米复合薄膜显示出超低的介电损耗 (0.006) 和降低的介电常数 (2.69)。此外，以PI/FEP薄膜为介质绝缘层的高频柔性电路板具有0.75 N·mm的高剥离强度-1，表明该PI/FEP纳米复合薄膜能够满足高频柔性电路板应用的要求。
更新日期：2021-04-19
中文翻译：
用于高频柔性电路板应用的低介电聚酰亚胺/氟化乙烯丙烯 (PI/FEP) 纳米复合薄膜
低介电聚合物薄膜在高频电路板中作为介电绝缘材料的应用受到了极大的关注，而由于氟化或刚性结构导致对铜箔的附着力弱和加工性差，限制了其高频应用。在这项工作中，开发了用于高频柔性电路板应用的低介电和高粘合性聚酰亚胺/氟化乙丙烯（PI/FEP）纳米复合薄膜。结果表明，氟碳表面活性剂可以显着提高FEP在PI基材中的分散性，从而使PI/FEP纳米复合薄膜表现出优异的力学性能，包括拉伸强度提高到46.6 MPa，断裂伸长率提高到13.7% . 重要的是，在 10 GHz 的高频下，60 wt% FEP 填充的 PI 纳米复合薄膜显示出超低的介电损耗 (0.006) 和降低的介电常数 (2.69)。此外，以PI/FEP薄膜为介质绝缘层的高频柔性电路板具有0.75 N·mm的高剥离强度-1，表明该PI/FEP纳米复合薄膜能够满足高频柔性电路板应用的要求。
京公网安备 11010802027423号