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Dissolving and Regeneration of meta-Aramid Paper: Converting Loose Structure into Consolidated Networks with Enhanced Mechanical and Insulation Properties
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2021-04-05 , DOI: 10.1021/acsami.1c02075
Jiaojun Tan 1, 2, 3 , Yanwei Luo 1 , Meiyun Zhang 1 , Bin Yang 1 , Fangfang Li 1 , Shaowei Ruan 1
Affiliation  

Aramid paper has been widely used in high-voltage motors and transformers due to its excellent insulation property and thermal durability. However, the smoothness and chemical inertness of aramid fibers lead to a loose structure (voids) of aramid paper, which limits its potential applications in harsh environments, such as high-frequency and high-voltage circuits. This work reports a simple and efficient method to improve the mechanical and insulation properties of meta-aramid paper via controllable dissolving and regeneration of aramid fibers. To obtain a dense and robust structure, the pristine meta-aramid paper was immersed in a dimethyl sulfoxide/potassium hydroxide (DMSO/KOH) mixture to make aramid fibers swelled and dissolved, followed by regeneration in water vapor, eventually generating densified aramid paper with fewer voids and enhanced insulation and mechanical performance. Optimum conditions resulted in aramid paper with the best comprehensive performance, and the tensile strength, Young’s modulus, and electrical breakdown strength of the consolidated aramid paper were 22.85 MPa, 0.72 GPa, and 15.3 kV/mm, respectively, which were significantly higher than those of the pristine aramid paper (12.53 MPa, 0.41 GPa, and 8.36 kV/mm). Meanwhile, such treatment did not cause any chemical structure change, and thus it still retained the excellent thermal resistance (Td > 430 °C) of aramid fibers. This simple method can effectively regulate the surface porosity and the mechanical and breakdown strength of aramid paper, as well as provide a generic method for postprocessing and enhancing aramid paper.

中文翻译:

芳纶纸的溶解和再生:将松散结构转变为具有增强的机械和绝缘性能的固结网络

芳纶纸由于其优异的绝缘性能和热耐久性而被广泛用于高压电动机和变压器中。但是,芳纶纤维的光滑度和化学惰性会导致芳纶纸的结构松散(空隙),从而限制了其在恶劣环境(例如高频和高压电路)中的潜在应用。这项工作报告了一种简单有效的方法,可通过控制芳族聚酰胺纤维的溶解和再生来提高间位芳纶纸的机械性能和绝缘性能。为了获得致密而坚固的结构,原始的将芳纶纸浸入二甲基亚砜/氢氧化钾(DMSO / KOH)混合物中,使芳纶纤维溶胀并溶解,然后在水蒸气中再生,最终生成致密的芳纶纸,空隙少,绝缘性和机械性能增强。在最佳条件下,芳纶纸的综合性能最佳,并且该复合芳纶纸的拉伸强度,杨氏模量和电击穿强度分别为22.85 MPa,0.72 GPa和15.3 kV / mm,明显高于那些。原始芳纶纸(12.53 MPa,0.41 GPa和8.36 kV / mm)。同时,这种处理没有引起任何化学结构变化,因此仍然保留了优异的耐热性(T d> 430°C)的芳纶纤维。这种简单的方法可以有效地调节芳纶纸的表面孔隙率以及机械强度和击穿强度,并为芳纶纸的后处理和增强提供通用方法。
更新日期:2021-04-14
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