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Sub-5 nm Monolayer MoS2 Transistors toward Low-Power Devices
ACS Applied Electronic Materials ( IF 4.3 ) Pub Date : 2021-03-15 , DOI: 10.1021/acsaelm.0c00840 Han Zhang 1, 2 , Bowen Shi 2 , Lin Xu 3 , Junfeng Yan 1 , Wu Zhao 1 , Zhiyong Zhang 1 , Zhiyong Zhang 3 , Jing Lu 2, 3, 4, 5
ACS Applied Electronic Materials ( IF 4.3 ) Pub Date : 2021-03-15 , DOI: 10.1021/acsaelm.0c00840 Han Zhang 1, 2 , Bowen Shi 2 , Lin Xu 3 , Junfeng Yan 1 , Wu Zhao 1 , Zhiyong Zhang 1 , Zhiyong Zhang 3 , Jing Lu 2, 3, 4, 5
Affiliation
Inspired by the recent achievements of the two-dimensional (2D) sub-5 nm MoS2 field effect transistors (FETs), we use the ab initio quantum-transport methods to simulate the transport properties of the sub-5 nm gate-length monolayer (ML) MoS2 MOSFETs. We find that the ML MoS2 double-gated MOSFETs (DGFETs) with the 1, 3, and 5 nm gate length fail to meet the on-state current requirements in the International Technology Roadmap for Semiconductors (ITRS) for high-performance (HP) devices. However, both the ML MoS2n- and p-DGFETs with 5 nm gate length can address the requirements in the ITRS for low-power (LP) applications in terms of on-state current, effective delay time, and power-delay products (PDPs). After the introduction of the negative capacitance dielectric layer, the ML MoS2p-DGFETs can satisfy the LP application requirements of ITRS until the gate length scales down to 3 nm. Hence, ML MoS2 remains a potential channel candidate for LP applications in the sub-5 nm scale.
中文翻译:
面向低功率器件的亚5纳米单层MoS 2晶体管
受二维(2D)低于5 nm的MoS 2场效应晶体管(FET)的最新成就的启发,我们使用从头算量子传输方法来模拟低于5 nm栅长单层的传输特性(ML)MoS 2 MOSFET。我们发现具有1,3和5 nm栅极长度的ML MoS 2双栅极MOSFET(DGFET)不能满足《国际半导体技术路线图(ITRS)》关于高性能(HP ) 设备。但是,ML MoS 2 n-和p栅极长度为5 nm的DGFET可以满足ITRS对低功率(LP)应用的要求,包括导通状态电流,有效延迟时间和功率延迟乘积(PDP)。引入负电容介电层后,ML MoS 2 p- DGFET可以满足ITRS的LP应用要求,直到栅极长度缩小到3 nm。因此,ML MoS 2仍然是5纳米以下LP应用的潜在通道候选者。
更新日期:2021-04-27
中文翻译:
面向低功率器件的亚5纳米单层MoS 2晶体管
受二维(2D)低于5 nm的MoS 2场效应晶体管(FET)的最新成就的启发,我们使用从头算量子传输方法来模拟低于5 nm栅长单层的传输特性(ML)MoS 2 MOSFET。我们发现具有1,3和5 nm栅极长度的ML MoS 2双栅极MOSFET(DGFET)不能满足《国际半导体技术路线图(ITRS)》关于高性能(HP ) 设备。但是,ML MoS 2 n-和p栅极长度为5 nm的DGFET可以满足ITRS对低功率(LP)应用的要求,包括导通状态电流,有效延迟时间和功率延迟乘积(PDP)。引入负电容介电层后,ML MoS 2 p- DGFET可以满足ITRS的LP应用要求,直到栅极长度缩小到3 nm。因此,ML MoS 2仍然是5纳米以下LP应用的潜在通道候选者。