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Bi-Phasic Ag–In–Ga-Embedded Elastomer Inks for Digitally Printed, Ultra-Stretchable, Multi-layer Electronics
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2021-03-10 , DOI: 10.1021/acsami.0c22206 Pedro Alhais Lopes 1 , Daniel Félix Fernandes 1 , André F. Silva 1 , Daniel Green Marques 1 , Aníbal T. de Almeida 1 , Carmel Majidi 2 , Mahmoud Tavakoli 1
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2021-03-10 , DOI: 10.1021/acsami.0c22206 Pedro Alhais Lopes 1 , Daniel Félix Fernandes 1 , André F. Silva 1 , Daniel Green Marques 1 , Aníbal T. de Almeida 1 , Carmel Majidi 2 , Mahmoud Tavakoli 1
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A bi-phasic ternary Ag–In–Ga ink that demonstrates high electrical conductivity, extreme stretchability, and low electromechanical gauge factor (GF) is introduced. Unlike popular liquid metal alloys such as eutectic gallium–indium (EGaIn), this ink is easily printable and nonsmearing and bonds strongly to a variety of substrates. Using this ink and a simple extrusion printer, the ability to perform direct writing of ultrathin, multi-layer circuits that are highly stretchable (max. strain >600%), have excellent conductivity (7.02 × 105 S m–1), and exhibit only a modest GF (0.9) related to the ratio of percent increase in trace resistance with mechanical strain is demonstrated. The ink is synthesized by mixing optimized quantities of EGaIn, Ag microflakes, and styrene-isoprene block copolymers, which functions as a hyperelastic binder. When compared to the same composite without EGaIn, the Ag–In–Ga ink shows over 1 order of magnitude larger conductivity, up to ∼27× lower GF, and ∼5× greater maximum stretchability. No significant change over the resistance of the ink was observed after 1000 strain cycles. Microscopic analysis shows that mixing EGaIn and Ag microflakes promotes the formation of AgIn2 microparticles, resulting in a cohesive bi-phasic ink. The ink can be sintered at room temperature, making it compatible with many heat-sensitive substrates. Additionally, utilizing a simple commercial extrusion based printer, the ability to perform stencil-free, digital printing of multi-layer stretchable circuits over various substrates, including medical wound-dressing adhesives, is demonstrated for the first time.
中文翻译：
用于数字印刷，超拉伸，多层电子产品的双相Ag-In-Ga嵌入式弹性体油墨
介绍了一种两相三元银-铟-镓油墨，该油墨显示出高电导率，极高的可拉伸性和低机电规系数（GF）。与流行的液态金属合金（如共晶镓铟铟（EGaIn））不同，这种墨水易于印刷且不粘污，并且可以牢固地粘合到各种基材上。使用这种墨水和简单的挤出打印机，就可以直接书写高度可拉伸的超薄多层电路（最大应变> 600％），并具有出色的导电性（7.02×10 5 S m –1）），并且仅显示出适度的GF（0.9），该值与走线电阻与机械应变的增加百分比之比有关。通过混合优化量的EGaIn，Ag微薄片和用作超弹性粘合剂的苯乙烯-异戊二烯嵌段共聚物来合成油墨。与不含EGaIn的相同复合材料相比，Ag-In-Ga墨水显示出大于1个数量级的导电性，低至GF约低27倍，最大可拉伸性高至约5倍。在1000次应变循环后，未观察到油墨电阻的显着变化。显微分析表明，将EGaIn和Ag微薄片混合可促进AgIn 2的形成微粒，产生粘性的两相墨水。可以在室温下烧结墨水，使其与许多热敏基材兼容。另外，首次展示了利用基于商业挤压的简单打印机，能够在包括医用伤口敷料粘合剂在内的各种基材上进行多层可拉伸电路的无模板数字印刷的能力。
更新日期：2021-03-31
中文翻译：
用于数字印刷，超拉伸，多层电子产品的双相Ag-In-Ga嵌入式弹性体油墨
介绍了一种两相三元银-铟-镓油墨，该油墨显示出高电导率，极高的可拉伸性和低机电规系数（GF）。与流行的液态金属合金（如共晶镓铟铟（EGaIn））不同，这种墨水易于印刷且不粘污，并且可以牢固地粘合到各种基材上。使用这种墨水和简单的挤出打印机，就可以直接书写高度可拉伸的超薄多层电路（最大应变> 600％），并具有出色的导电性（7.02×10 5 S m –1）），并且仅显示出适度的GF（0.9），该值与走线电阻与机械应变的增加百分比之比有关。通过混合优化量的EGaIn，Ag微薄片和用作超弹性粘合剂的苯乙烯-异戊二烯嵌段共聚物来合成油墨。与不含EGaIn的相同复合材料相比，Ag-In-Ga墨水显示出大于1个数量级的导电性，低至GF约低27倍，最大可拉伸性高至约5倍。在1000次应变循环后，未观察到油墨电阻的显着变化。显微分析表明，将EGaIn和Ag微薄片混合可促进AgIn 2的形成微粒，产生粘性的两相墨水。可以在室温下烧结墨水，使其与许多热敏基材兼容。另外，首次展示了利用基于商业挤压的简单打印机，能够在包括医用伤口敷料粘合剂在内的各种基材上进行多层可拉伸电路的无模板数字印刷的能力。
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