This study proposed the method of “differential analysis” based on the study and analysis of the die-bonding technology in semiconductor laser packaging by using the analysis of ray tracing and thermal characteristics to explore the influence of the differential (Δx, the position error between the laser chip and the Submount) on the optical efficiency and heat dissipation performance of the device. Under the influence of the "underhang" effect, the value of Δx was controlled within 12 μm, which can effectively stabilize the output power of the device. Under the influence of the "overhang" effect, the Δx will not have substantial impact on the heat dissipation characteristics of the device. The submount which has the new chamfered structure is designed using this structure, COS (chip on submount) prepared in the semiconductor laser die-bonding technology was shown to exhibit higher stability and reliability.

本研究基于对半导体激光封装中的芯片键合技术的研究和分析，提出了一种“差异分析”的方法，利用射线追踪和热特性分析，探讨了差异（Δx，两者之间的位置误差）的影响。激光芯片和Submount）的光学效率和设备的散热性能。在“悬垂”效应的影响下，将Δx的值控制在12μm以内，可以有效地稳定器件的输出功率。在“突出”效应的影响下，Δx不会对器件的散热特性产生实质性影响。使用这种结构设计了具有新倒角结构的底座，