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Electrostatic Actuating Double‐Unit Electrocaloric Cooling Device with High Efficiency
Advanced Energy Materials ( IF 24.4 ) Pub Date : 2021-02-12 , DOI: 10.1002/aenm.202003771
Yiwen Bo 1 , Quan Zhang 1 , Heng Cui 1 , Mengyan Wang 1 , Chunyang Zhang 1 , Wen He 1 , Xiangqian Fan 1 , Yiwen Lv 1 , Xiang Fu 1 , Jiajie Liang 1 , Yi Huang 1 , Rujun Ma 1 , Yongsheng Chen 2
Advanced Energy Materials ( IF 24.4 ) Pub Date : 2021-02-12 , DOI: 10.1002/aenm.202003771
Yiwen Bo 1 , Quan Zhang 1 , Heng Cui 1 , Mengyan Wang 1 , Chunyang Zhang 1 , Wen He 1 , Xiangqian Fan 1 , Yiwen Lv 1 , Xiang Fu 1 , Jiajie Liang 1 , Yi Huang 1 , Rujun Ma 1 , Yongsheng Chen 2
Affiliation
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Compact solid‐state refrigeration systems that offer a high specific cooling power and a high coefficient of performance (COP) are desirable in a wide range of applications where efficient and localized heat transfer is required. Here, a double‐unit electrocaloric (EC) polymer‐based refrigeration device with high intrinsic thermodynamic efficiency is demonstrated using a flexible EC polymer film with improved performance by doping plasticizer and an electrostatic actuation mechanism. The double‐unit refrigeration device achieves a large temperature span of 4.8 K, which is 71% higher than that of the single‐unit device. A specific cooling power of 3.6 W g−1 and a maximum COP of 8.3 for the cooling device are produced. The surface temperature of a central processing unit (CPU) cooled by an active EC device is 22.4 K lower than that of the CPU cooled in air. The highly efficient and compact EC cooling device demonstrated here not only leapfrogs the performance of existing solid‐state cooling technologies, but also brings solid state cooling closer to reality for a variety of practical applications that require compact or mechanically flexible refrigeration.
中文翻译:
高效静电驱动双单元电热冷却装置
具有高比制冷能力和高性能系数(COP)的紧凑型固态制冷系统在需要有效和局部传热的广泛应用中是理想的。在这里,通过使用掺有增塑剂和静电激励机制的柔性EC聚合物薄膜,具有更高的性能,展示了具有高固有热力学效率的基于双单元电热(EC)聚合物的制冷设备。双单元制冷设备的温度跨度高达4.8 K,比单单元制冷设备高71%。比冷却功率为3.6 W g -1冷却设备的最大COP为8.3。由活动EC设备冷却的中央处理器(CPU)的表面温度比在空气中冷却的CPU的表面温度低22.4K。此处展示的高效,紧凑的EC冷却装置不仅超越了现有固态冷却技术的性能,而且使固态冷却在需要紧凑或机械灵活制冷的各种实际应用中更加接近现实。
更新日期:2021-04-08
中文翻译:
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高效静电驱动双单元电热冷却装置
具有高比制冷能力和高性能系数(COP)的紧凑型固态制冷系统在需要有效和局部传热的广泛应用中是理想的。在这里,通过使用掺有增塑剂和静电激励机制的柔性EC聚合物薄膜,具有更高的性能,展示了具有高固有热力学效率的基于双单元电热(EC)聚合物的制冷设备。双单元制冷设备的温度跨度高达4.8 K,比单单元制冷设备高71%。比冷却功率为3.6 W g -1冷却设备的最大COP为8.3。由活动EC设备冷却的中央处理器(CPU)的表面温度比在空气中冷却的CPU的表面温度低22.4K。此处展示的高效,紧凑的EC冷却装置不仅超越了现有固态冷却技术的性能,而且使固态冷却在需要紧凑或机械灵活制冷的各种实际应用中更加接近现实。