Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink and electroless plating (ELP) copper at room temperature. The Cu NPs served as the catalyst to promote copper ions electroless deposition on PET surface. Dimethylaminoborane (DMAB) was used as the reductant to place poisonous formaldehyde in the electroless plating process. The Cu patterns had a strong adhesion with PET substrate modified by 3-Mercaptopropyltriethoxysilane (MPTES) and would not fall even after 4000 cycles bending test. The electric resistivity of patterns could be as low as 5.43 μΩ·cm, which is about three times that of bulk copper. The minimum sheet resistance of the patterns was 54 mΩ/sq and had little change in the atmosphere for five months, that showed the patterns had an excellent anti-oxidation performance.

通过将喷墨打印纸与铜纳米颗粒（Cu NPs）导电墨水和化学镀（ELP）铜结合，在热敏聚对苯二甲酸乙二醇酯（PET）基材上成功制备了低电阻，良好粘合性和高稳定性的柔性导电铜图案。室内温度。Cu NPs用作促进铜离子在PET表面化学沉积的催化剂。在化学镀过程中，使用二甲基氨基硼烷（DMAB）作为还原剂来放置有毒的甲醛。Cu图案与经3-巯基丙基三乙氧基硅烷（MPTES）改性的PET基材具有很强的附着力，即使经过4000次弯曲试验也不会掉落。图案的电阻率可低至5.43μΩ·cm，约为本体铜的三倍。