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Effects of grinding speed on the material removal mechanism in single grain grinding of SiCf/SiC ceramic matrix composite
Ceramics International ( IF 5.1 ) Pub Date : 2021-01-21 , DOI: 10.1016/j.ceramint.2021.01.140
Jingfei Yin , Jiuhua Xu , Wenfeng Ding , Honghua Su

Silicon carbide (SiC) fibers reinforced SiC ceramic matrix composite (SiCf/SiC) is an advanced material for aeroengines because of its high-temperature resistance and high specific strength. However, it is rather difficult to machine. Though there have been many methods available for machining SiCf/SiC, the material removal mechanism is not fully understood and the machining efficiency is still low. This paper studies the effects of grinding speed on the material removal mechanism of SiCf/SiC by single grain grinding. Results indicate that increasing speed grinding could embrittle the material and enhance the breakage of fibers. When grinding along the fiber longitude direction, fibers present brittle fracture and matrix is torn off in high speed grinding rather than the ploughing in fibers or the smearing in matrix in low speed grinding. When grinding transverse to the fiber longitude direction, fibers are removed completely without any residual cut-off fiber end which is common in low speed grinding. Both the groove surface quality and machining efficiency are improved by increasing speed grinding.



中文翻译:

SiC f / SiC陶瓷基复合材料单粒磨削中磨削速度对材料去除机理的影响

碳化硅(SiC)纤维增强SiC陶瓷基复合材料(SiC f / SiC)由于其耐高温性和高比强度而成为航空发动机的先进材料。但是,很难加工。尽管有许多方法可用于加工SiC f / SiC,但是材料去除机理尚未得到充分理解,并且加工效率仍然很低。本文研究了磨削速度对SiC f材料去除机理的影响。/ SiC通过单颗粒研磨。结果表明,提高速度的研磨可能会使材料变脆并增加纤维的断裂。沿纤维纵向方向研磨时,纤维会出现脆性断裂,在高速研磨中会撕裂基体,而不是在低速研磨中会撕裂纤维或在基体上产生污迹。当横向于纤维纵向方向进行研磨时,纤维会被完全清除,而没有任何残留的切割纤维末端,这在低速研磨中很常见。通过提高磨削速度可以提高凹槽表面质量和加工效率。

更新日期:2021-01-22
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