Cu Plating with Sn and Subsequent Bronze Formation under Mild Conditions,Journal of Chemical Education

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Cu Plating with Sn and Subsequent Bronze Formation under Mild Conditions
Journal of Chemical Education ( IF 2.5 ) Pub Date : 2021-01-19 , DOI: 10.1021/acs.jchemed.0c00552
Takahiro Suzuki _{1,

2} , Masayuki Inoue ₃

Affiliation

In a well-known bronze plating experiment, a Cu coupon is subjected to Sn plating and heating with a Bunsen burner. Currently, aqueous NaOH or HCl is typically used as the plating solution; however, the use of a strong acid or base provides operational risks, particularly in educational settings (e.g., schools). Herein, we introduce a modified method that uses aqueous NaHSO₄ as the plating solution. This method reduces the operational risks and allows for the smooth deposition of silver-white Sn onto the Cu coupon in a higher yield than that obtained by the HCl method, which uses 30 times the concentration of the solute. When the Sn-plated Cu coupon is heated, it changes to bronze plating. This experiment is ideal for high school students, as it allows them to observe metal plating and solid diffusion.

中文翻译：

温和条件下镀锡和随后形成青铜的铜镀层

在众所周知的青铜镀覆实验中，对铜试样块进行镀锡，然后用本生灯进行加热。目前，通常使用NaOH或HCl水溶液作为电镀液。但是，使用强酸或强碱会带来操作风险，尤其是在教育环境（例如学校）中。在这里，我们介绍一种使用NaHSO ₄水溶液作为电镀液的改进方法。该方法降低了操作风险，并允许将银白色Sn顺利沉积到Cu试样上，产率高于使用HCl方法的HCl方法（后者使用的是溶质浓度的30倍）。当镀锡的铜试样被加热时，它变成镀青铜。这个实验非常适合高中生，因为它可以让他们观察金属镀层和固体扩散。

更新日期：2021-03-09

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