Abstract Hexagonal boron nitride (BN) platelets are often used as fillers to improve the thermal conductivity (λ) of polymer matrix composites thanks to their good insulation and high thermal conductivity (λ). However, the low compatibility between polymeric matrices and BN platelets results in interfacial phonon scattering, interfering with the composite's heat transfer. In this paper, functionalized BN platelets were first modified with poly(catechol/polyamine) (PCPA) and then grafted with bis-(γ-triethoxysilylpropyl)-tetrasulfide (Si69) to yield BN-PCPA-Si69/natural rubber composites (denoted as BN-PCPA-Si69/NR). PCPA coating declined the interfacial phonon scattering between the matrix and fillers, while silane grafting improved the interfacial interaction via NR vulcanization with tetrasulfide bonds in Si69. In turn, these features led to improved dielectric characteristics, thermal conductivities, and mechanical properties. Among prepared samples, NR composite filled with 30% volume BN-PCPA-Si69 platelets content yielded a thermal conductivity 5.4-fold higher (λ = 0.81 W/mK) than that of neat NR (λ = 0.15 W/mK). The mechanical performances of BN-PCPA-Si69/NR composites also improved significantly with the maximum tensile strength reaching up 17.0 MPa. In sum, the proposed method looks inexpensive and feasible for the fabrication of high thermal conductive polymer composites for use in future advanced electronic devices, such as insulating and packaging electronic materials.

中文翻译：

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通过共价和非共价相互作用改性氮化硼制备具有增强导热性的天然橡胶复合材料

摘要 六方氮化硼 (BN) 片晶因其良好的绝缘性和高导热性 (λ) 常被用作填料以提高聚合物基复合材料的导热性 (λ)。然而，聚合物基体和 BN 片晶之间的低相容性导致界面声子散射，干扰复合材料的传热。在本文中，首先用聚（儿茶酚/聚胺）（PCPA）修饰功能化的 BN 薄片，然后用双-（γ-三乙氧基甲硅烷基丙基）-四硫化物（Si69）接枝，得到 BN-PCPA-Si69/天然橡胶复合材料（表示为BN-PCPA-Si69/NR)。PCPA 涂层降低了基体和填料之间的界面声子散射，而硅烷接枝通过 NR 硫化与 Si69 中的四硫键改善了界面相互作用。反过来，这些特性导致了介电特性、热导率和机械性能的改善。在制备的样品中，填充 30% 体积 BN-PCPA-Si69 片晶含量的 NR 复合材料产生的热导率比纯 NR（λ = 0.15 W/mK）高 5.4 倍（λ = 0.81 W/mK）。BN-PCPA-Si69/NR 复合材料的力学性能也显着提高，最大拉伸强度达到 17.0 MPa。总之，所提出的方法对于制造用于未来先进电子设备（例如绝缘和封装电子材料）的高导热聚合物复合材料来说看起来既便宜又可行。填充 30% 体积 BN-PCPA-Si69 片晶含量的 NR 复合材料产生的热导率比纯 NR (λ = 0.15 W/mK) 高 5.4 倍 (λ = 0.81 W/mK)。BN-PCPA-Si69/NR 复合材料的力学性能也显着提高，最大拉伸强度达到 17.0 MPa。总之，所提出的方法对于制造用于未来先进电子设备（例如绝缘和封装电子材料）的高导热聚合物复合材料来说看起来既便宜又可行。填充 30% 体积 BN-PCPA-Si69 片晶含量的 NR 复合材料产生的热导率比纯 NR (λ = 0.15 W/mK) 高 5.4 倍 (λ = 0.81 W/mK)。BN-PCPA-Si69/NR 复合材料的力学性能也显着提高，最大拉伸强度达到 17.0 MPa。总之，所提出的方法对于制造用于未来先进电子设备（例如绝缘和封装电子材料）的高导热聚合物复合材料来说看起来既便宜又可行。