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A generalized sample preparation method by incorporation of metal–organic compounds into polymers for electroless metallization
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2020-11-10 , DOI: 10.1002/app.50276 Atilla Atli 1 , Vanessa Trouillet 2 , Francisco J. Cadete Santos Aires 3, 4 , Eric Ehret 3 , Etienne Lemaire 1 , Sandra Simon 1
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2020-11-10 , DOI: 10.1002/app.50276 Atilla Atli 1 , Vanessa Trouillet 2 , Francisco J. Cadete Santos Aires 3, 4 , Eric Ehret 3 , Etienne Lemaire 1 , Sandra Simon 1
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Polymer metallization is important for several applications but triggering of electroless deposition is problematic. A simple and inexpensive method to prepare the polymers for initiating the electroless copper deposition is successfully applied to Liquid Crystal Polymer and Polyethylene Terephthalate. The samples are prepared by incorporation of a small amount (<0.5 wt%) of metal–organic compounds (palladium, nickel, or copper acetates) in the molten polymers. During blending, the polymers are held at sufficiently high temperatures to thermally decompose the acetates, yielding the metallic particles (Pd, Ni, or Cu) which are used as the activators. After surface preparation, copper is deposited on polymers in an electroless bath including formaldehyde as reducer. The influence of bath parameters (temperature, composition) and the nature of activators is investigated. This method can be extended to other polymers by finding an appropriate polymer/metal–organic couple. It is also demonstrated that cheaper Ni or Cu can substitute expensive Pd.
中文翻译：
通过将金属有机化合物掺入聚合物中进行化学镀的通用样品制备方法
聚合物金属化对于几种应用很重要，但是触发无电沉积是有问题的。一种简单且廉价的制备聚合物以引发化学镀铜的方法已成功应用于液晶聚合物和聚对苯二甲酸乙二醇酯。通过在熔融聚合物中加入少量（<0.5 wt％）的金属有机化合物（钯，镍或乙酸铜）来制备样品。在共混期间，将聚合物保持在足够高的温度下以使乙酸盐热分解，得到用作活化剂的金属颗粒（Pd，Ni或Cu）。表面处理后，将铜沉积在包括甲醛作为还原剂的化学镀浴中的聚合物上。浴液参数的影响（温度，组成）和活化剂的性质进行了研究。通过找到合适的聚合物/金属-有机对，可以将该方法扩展到其他聚合物。还表明，较便宜的Ni或Cu可以代替昂贵的Pd。
更新日期：2020-11-10
中文翻译：
通过将金属有机化合物掺入聚合物中进行化学镀的通用样品制备方法
聚合物金属化对于几种应用很重要，但是触发无电沉积是有问题的。一种简单且廉价的制备聚合物以引发化学镀铜的方法已成功应用于液晶聚合物和聚对苯二甲酸乙二醇酯。通过在熔融聚合物中加入少量（<0.5 wt％）的金属有机化合物（钯，镍或乙酸铜）来制备样品。在共混期间，将聚合物保持在足够高的温度下以使乙酸盐热分解，得到用作活化剂的金属颗粒（Pd，Ni或Cu）。表面处理后，将铜沉积在包括甲醛作为还原剂的化学镀浴中的聚合物上。浴液参数的影响（温度，组成）和活化剂的性质进行了研究。通过找到合适的聚合物/金属-有机对，可以将该方法扩展到其他聚合物。还表明，较便宜的Ni或Cu可以代替昂贵的Pd。
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